EP 2232532 A2 20100929 - METHOD FOR LOCAL ETCHING OF THE SURFACE OF A SUBSTRATE
Title (en)
METHOD FOR LOCAL ETCHING OF THE SURFACE OF A SUBSTRATE
Title (de)
VERFAHREN ZUR LOKALEN ÄTZUNG DER OBERFLÄCHE EINES SUBSTRATS
Title (fr)
PROCEDE DE GRAVURE LOCALISEE DE LA SURFACE D'UN SUBSTRAT
Publication
Application
Priority
- FR 2008001820 W 20081223
- FR 0800035 A 20080103
Abstract (en)
[origin: WO2009103907A2] The invention relates to a method for the local etching of the surface of a substrate, characterised in that it comprises: a) making a gas-pervious polymer pad that comprises three-dimensional patterns on one surface thereof; b) contacting the surface including the pad patterns with the substrate; c) submitting the pad/substrate assembly to a plasma so that the species present in the plasma are accelerated and diffused through the pad until they reach the substrate.
IPC 8 full level
H01L 21/033 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01)
CPC (source: EP US)
B81C 1/00206 (2013.01 - EP US); B82Y 10/00 (2013.01 - EP US); B82Y 40/00 (2013.01 - EP US); G03F 7/0002 (2013.01 - EP US); H01L 21/033 (2013.01 - EP US); H01L 21/3065 (2013.01 - EP US); H01L 21/3081 (2013.01 - EP US); H01L 21/3105 (2013.01 - EP US); H01L 21/31058 (2013.01 - EP US); H01L 21/31138 (2013.01 - EP US); H01L 21/31144 (2013.01 - EP US)
Citation (search report)
See references of WO 2009103907A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
FR 2926162 A1 20090710; FR 2926162 B1 20170901; EP 2232532 A2 20100929; JP 2011512646 A 20110421; JP 5715421 B2 20150507; US 2011017705 A1 20110127; US 8475671 B2 20130702; WO 2009103907 A2 20090827; WO 2009103907 A3 20091022
DOCDB simple family (application)
FR 0800035 A 20080103; EP 08872521 A 20081223; FR 2008001820 W 20081223; JP 2010541081 A 20081223; US 81146708 A 20081223