EP 2235749 A1 20101006 - METHOD OF COATING FINE WIRES AND CURABLE COMPOSITION THEREFOR
Title (en)
METHOD OF COATING FINE WIRES AND CURABLE COMPOSITION THEREFOR
Title (de)
VERFAHREN ZUR BESCHICHTUNG VON FEINEN DRÄHTEN UND AUSHÄRTBARE ZUSAMMENSETZUNG DAFÜR
Title (fr)
PROCÉDÉ DE REVÊTEMENT DE FILS FINS ET COMPOSITION DURCISSABLE À CET EFFET
Publication
Application
Priority
- US 2008083323 W 20081113
- US 1448307 P 20071218
Abstract (en)
[origin: WO2009079122A1] A method of reducing wire sweep and shorting during fabrication of a semiconductor device includes spraying a curable composition onto wire bonds, and free-radically B-staging the curable composition, and then thermal curing to a C-stage. A sprayable curable composition is also disclosed.
IPC 8 full level
H01L 23/29 (2006.01); C08J 3/24 (2006.01); C08L 63/00 (2006.01)
CPC (source: EP)
C08L 63/00 (2013.01); H01L 21/56 (2013.01); H01L 23/293 (2013.01); H01L 23/3135 (2013.01); H01L 24/85 (2013.01); C08L 33/00 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48599 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01031 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01054 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01084 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/14 (2013.01)
Citation (search report)
See references of WO 2009079122A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
WO 2009079122 A1 20090625; CN 101903999 A 20101201; EP 2235749 A1 20101006; JP 2011508966 A 20110317; KR 20100095014 A 20100827; TW 200935529 A 20090816
DOCDB simple family (application)
US 2008083323 W 20081113; CN 200880121458 A 20081113; EP 08862170 A 20081113; JP 2010539557 A 20081113; KR 20107015654 A 20081113; TW 97146037 A 20081127