Global Patent Index - EP 2240548 A1

EP 2240548 A1 20101020 - THERMALLY-ACTIVATED AND HARDENABLE ADHESIVE FOIL, ESPECIALLY FOR ADHESION OF ELECTRONIC COMPONENTS AND FLEXIBLE PRINTED CIRCUIT PATHS

Title (en)

THERMALLY-ACTIVATED AND HARDENABLE ADHESIVE FOIL, ESPECIALLY FOR ADHESION OF ELECTRONIC COMPONENTS AND FLEXIBLE PRINTED CIRCUIT PATHS

Title (de)

THERMISCH AKTIVIER- UND HÄRTBARE KLEBFOLIE INSBESONDERE FÜR DIE VERKLEBUNG VON ELEKTRONISCHEN BAUTEILEN UND FLEXIBLEN GEDRUCKTEN LEITERBAHNEN

Title (fr)

FEUILLE ADHÉSIVE THERMO-ACTIVABLE ET THERMODURCISSABLE, NOTAMMENT POUR COLLER DES COMPOSANTS ÉLECTRONIQUES ET DES CIRCUITS IMPRIMÉS SOUPLES

Publication

EP 2240548 A1 20101020 (DE)

Application

EP 09707941 A 20090127

Priority

  • EP 2009050866 W 20090127
  • DE 102008007749 A 20080205

Abstract (en)

[origin: WO2009098141A1] Termally-activated and -hardenable adhesive foil, especially for adhesion of electronic components and flexible printed circuit paths consisting of an adhesive material which is composed of at least a) one chemically crosslinked or at least partially crosslinked polyurethane, b) one at least bifunctional epoxy resin, c) one hardener for the epoxy resin, wherein the epoxy groups react chemically with the hardener at high temperatures, characterized in that at least one of the starting materials of the polyurethane is a hydroxyl-functionalized polycarbonate and at least one of the starting materials of the polyurethane has a functionality greater than two.

IPC 8 full level

C09J 7/02 (2006.01)

CPC (source: EP KR US)

C08G 18/4045 (2013.01 - EP US); C08G 18/44 (2013.01 - EP US); C08G 18/664 (2013.01 - EP US); C08G 18/755 (2013.01 - EP US); C09J 7/22 (2017.12 - KR); C09J 7/30 (2017.12 - KR); C09J 7/35 (2017.12 - KR); C09J 163/00 (2013.01 - KR); C09J 175/04 (2013.01 - EP KR US); H01L 21/67 (2013.01 - KR); H05K 1/0393 (2013.01 - KR); H05K 3/281 (2013.01 - KR); H05K 3/386 (2013.01 - EP KR US); C08L 63/00 (2013.01 - EP US); C09J 2203/00 (2013.01 - KR); C09J 2301/304 (2020.08 - KR); H01L 2021/60015 (2013.01 - KR); H05K 1/0393 (2013.01 - EP US); H05K 3/281 (2013.01 - EP US)

Citation (search report)

See references of WO 2009098141A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

DE 102008007749 A1 20090806; EP 2240548 A1 20101020; JP 2011512430 A 20110421; KR 20100122078 A 20101119; TW 200936727 A 20090901; US 2010307682 A1 20101209; WO 2009098141 A1 20090813

DOCDB simple family (application)

DE 102008007749 A 20080205; EP 09707941 A 20090127; EP 2009050866 W 20090127; JP 2010545432 A 20090127; KR 20107017072 A 20090127; TW 97151534 A 20081231; US 86469309 A 20090127