EP 2243025 A1 20101027 - DEVICE FOR FIXING AN ELECTRONIC COMPONENT TO A CARRIER BY MEANS OF A CONDUCTIVE REFRACTORY METAL-GLASS PASTE
Title (en)
DEVICE FOR FIXING AN ELECTRONIC COMPONENT TO A CARRIER BY MEANS OF A CONDUCTIVE REFRACTORY METAL-GLASS PASTE
Title (de)
EINRICHTUNG ZUR FIXIERUNG EINES ELEKTRONISCHEN BAUSTEINS AUF EINEM TRÄGER MITTELS EINER LEITFÄHIGEN HOCHSCHMELZENDEN METALL-GLAS- PASTE
Title (fr)
DISPOSITIF POUR IMMOBILISER UN COMPOSANT ÉLECTRONIQUE SUR UN SUPPORT AU MOYEN D UNE PÂTE CONDUCTRICE MÉTAL-VERRE À POINT DE FUSION ÉLEVÉ
Publication
Application
Priority
- EP 2008068335 W 20081230
- DE 102008008535 A 20080211
Abstract (en)
[origin: WO2009100797A1] The invention relates to a device for fixing and/or attaching an electronic component such as a semiconductor element (1), and the electroconductive connection thereof to strip conductors, to a carrier (2), by means of a fixing element or a fixing means (3). The fixing element or means (3) is designed such that it maintains its fixing properties at operating temperatures of up to at least 500°C, and the electronic component is placed on the carrier (2) by means of a paste (3) containing Ag, and fixed or rigidly connected to said carrier. The paste (3) preferably comprises a glass part of between 5 vol % and 25 vol %, especially between 10 vol % and 15 vol %, in relation to the solid part, which melts at a baking temperature of approx. = 600 °C, and wets the surface of the carrier at certain points, thereby creating adhesion points to which the sintered metal, such as Ag, adheres or sticks.
IPC 8 full level
G01N 27/414 (2006.01); G01N 33/00 (2006.01)
CPC (source: EP)
H01L 24/12 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); G01N 27/414 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/29 (2013.01); H01L 2224/29298 (2013.01); H01L 2224/8389 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01044 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/15787 (2013.01)
Citation (search report)
See references of WO 2009100797A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
DE 102008008535 A1 20090813; EP 2243025 A1 20101027; WO 2009100797 A1 20090820
DOCDB simple family (application)
DE 102008008535 A 20080211; EP 08872385 A 20081230; EP 2008068335 W 20081230