EP 2243341 A1 20101027 - A METHOD OF DEPTH ROUTING AN ELECTRONIC LAYUP AND APPARATUS FOR EFFECTING SUCH A METHOD
Title (en)
A METHOD OF DEPTH ROUTING AN ELECTRONIC LAYUP AND APPARATUS FOR EFFECTING SUCH A METHOD
Title (de)
VERFAHREN ZUM TIEFENROUTING EINES ELEKTRONISCHEN LAYUP UND VORRICHTUNG ZUR DURCHFÜHRUNG SOLCH EINES VERFAHRENS
Title (fr)
PROCÉDÉ DE ROUTAGE DE PROFONDEUR D'UN EMPILEMENT ÉLECTRONIQUE ET DISPOSITIF POUR METTRE EN UVRE LE PROCÉDÉ
Publication
Application
Priority
- SG 2008000470 W 20081209
- SG 2008001828 A 20080108
Abstract (en)
[origin: WO2009088363A1] A method of depth routing an electronic layup comprised of a dielectric sandwiched between a metal layer and a metal substrate which is then laminated. The method involves first positioning a hardened mask so that the mask is interposed between the metal layer and at least one nozzle of a sandblasting machine, the mask having at least one aperture provided therein. Thereafter, the electronic layup is sandblasted through the at least one aperture by way of the sandblasting machine. The force, size and type of abrasive applied by the sandblasting machine are sufficient to erode the metal layer and the dielectric but not the substrate.
IPC 8 full level
CPC (source: EP US)
B24C 1/00 (2013.01 - EP US); H05K 3/0044 (2013.01 - EP US); H05K 3/04 (2013.01 - EP US); H05K 1/056 (2013.01 - EP US); H05K 3/0061 (2013.01 - EP US); H05K 2203/025 (2013.01 - EP US); H05K 2203/0557 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
WO 2009088363 A1 20090716; EP 2243341 A1 20101027; EP 2243341 A4 20120530; JP 2011509834 A 20110331; SG 154342 A1 20090828; US 2010285725 A1 20101111
DOCDB simple family (application)
SG 2008000470 W 20081209; EP 08870035 A 20081209; JP 2010541419 A 20081209; SG 2008001828 A 20080108; US 81210108 A 20081209