EP 2247542 A1 20101110 - SYSTEM AND METHOD FOR COOLING SEMICONDUCTOR COATED HOT GLASS SHEETS
Title (en)
SYSTEM AND METHOD FOR COOLING SEMICONDUCTOR COATED HOT GLASS SHEETS
Title (de)
SYSTEM UND VERFAHREN ZUR KÜHLUNG HALBLEITERBESCHICHTETER HEISSGLASSCHEIBEN
Title (fr)
SYSTÈME ET PROCÉDÉ POUR REFROIDIR DES PLAQUES DE VERRE CHAUDES RECOUVERTES DE SEMI-CONDUCTEUR
Publication
Application
Priority
- US 2009030072 W 20090105
- US 2077208 A 20080128
Abstract (en)
[origin: US2009191031A1] A system (20, 20') and method for cooling semiconductor coated hot glass sheets in a cooling station (36) within a vacuum chamber (24). The semiconductor coated hot glass sheets are conveyed between radiant heat absorbing members (112) of a radiant heat absorber (110) to provide the cooling. In one embodiment the glass sheets are conveyed vertically for the cooling and in another the glass sheets are conveyed horizontally.
IPC 8 full level
C03B 25/08 (2006.01); C03B 25/087 (2006.01); C03B 29/08 (2006.01); C03B 29/10 (2006.01); C03B 35/20 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC (source: EP US)
C03B 25/08 (2013.01 - EP US); C03B 25/087 (2013.01 - EP US); C03B 29/08 (2013.01 - EP US); C03B 29/10 (2013.01 - EP US); C03B 35/20 (2013.01 - EP US); H01L 21/67109 (2013.01 - EP US); H01L 21/67173 (2013.01 - EP US); H01L 21/67712 (2013.01 - EP US); H01L 21/6776 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
US 2009191031 A1 20090730; CN 101959810 A 20110126; EP 2247542 A1 20101110; EP 2247542 A4 20120829; WO 2009097164 A1 20090806
DOCDB simple family (application)
US 2077208 A 20080128; CN 200980107276 A 20090105; EP 09705621 A 20090105; US 2009030072 W 20090105