Global Patent Index - EP 2247780 A2

EP 2247780 A2 20101110 - METHOD FOR PRODUCING A FLOOR COVERING SUBSTRATE AND FLOORING COMPRISING AT LEAST ONE ELECTRONIC CONSTRUCTION ELEMENT INTEGRATED THEREIN

Title (en)

METHOD FOR PRODUCING A FLOOR COVERING SUBSTRATE AND FLOORING COMPRISING AT LEAST ONE ELECTRONIC CONSTRUCTION ELEMENT INTEGRATED THEREIN

Title (de)

VERFAHREN ZUM HERSTELLEN EINER BODENBELAGUNTERLAGE UND FUSSBODEN MIT MINDESTENS EINEM DARIN INTEGRIERTEN ELEKTRONISCHEN BAUELEMENT

Title (fr)

PROCÉDÉ DE FABRICATION D'UNE SOUS-COUCHE DE REVÊTEMENT DE SOL ET SOL DANS LEQUELLE EST INTÉGRÉ AU MOINS UN COMPOSANT ÉLECTRONIQUE

Publication

EP 2247780 A2 20101110 (DE)

Application

EP 09713359 A 20090220

Priority

  • EP 2009052072 W 20090220
  • DE 102008010530 A 20080222

Abstract (en)

[origin: WO2009103806A2] In a method for producing a floor covering substrate, at least one electronic construction element is embedded in a layer comprising at least one curable material. In a method for producing a substrate layer for a floor covering substrate, a substrate layer is provided wherein the substrate layer comprises a permeable structure or a mesh structure. Further, at least one electronic construction element is disposed in the substrate layer and/or applied to the substrate layer.

IPC 8 full level

D06N 7/00 (2006.01); E04F 15/12 (2006.01); E04F 15/16 (2006.01)

CPC (source: EP US)

D06N 7/0089 (2013.01 - EP US); E04F 15/12 (2013.01 - EP US); E04F 15/185 (2013.01 - EP US); Y10T 156/10 (2015.01 - EP US); Y10T 156/1064 (2015.01 - EP US); Y10T 156/109 (2015.01 - EP US); Y10T 428/239 (2015.01 - EP US); Y10T 428/24612 (2015.01 - EP US); Y10T 428/249921 (2015.04 - EP US); Y10T 428/249953 (2015.04 - EP US); Y10T 428/2848 (2015.01 - EP US); Y10T 442/10 (2015.04 - EP US)

Citation (search report)

See references of WO 2009103806A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

DE 102008010530 A1 20090827; EP 2247780 A2 20101110; EP 2247780 B1 20150916; US 2011027520 A1 20110203; WO 2009103806 A2 20090827; WO 2009103806 A3 20100218

DOCDB simple family (application)

DE 102008010530 A 20080222; EP 09713359 A 20090220; EP 2009052072 W 20090220; US 91865909 A 20090220