EP 2250111 A2 20101117 - METHOD AND ARRANGEMENT FOR MEASURING THE NIP PRESSURE AND/OR PRESSURE PROFILE IN THE NIP OF A PRINTING UNIT OF A PRINTING PRESS
Title (en)
METHOD AND ARRANGEMENT FOR MEASURING THE NIP PRESSURE AND/OR PRESSURE PROFILE IN THE NIP OF A PRINTING UNIT OF A PRINTING PRESS
Title (de)
VERFAHREN UND ANORDNUNG ZUR MESSUNG DES ANPRESSDRUCKS UND/ODER DES DRUCKPROFILS BEIM WALZENFLÄCHENABSTAND EINER DRUCKEINHEIT EINER DRUCKMASCHINE
Title (fr)
PROCÉDÉ ET DISPOSITIF POUR MESURER LA PRESSION DANS LA PINCE ET/OU LE PROFIL DE PRESSION DANS LA PINCE D'UNE UNITÉ D'IMPRESSION D'UNE PRESSE À IMPRIMER
Publication
Application
Priority
- FI 2009050103 W 20090210
- FI 20080101 A 20080212
- FI 20080102 A 20080212
Abstract (en)
[origin: WO2009101251A2] The invention relates to a method and an arrangement for measuring the nip pressure and/or pressure profile in the nip of a printing unit of a printing press. A force and/or pressure sensor, such as a pressure sensitive film, for example, an EMFi film sensor, is installed on the counter roller, rubber roller or roller forming the nip of a printing unit which participates in the printing unit in transferring printing ink onto the paper, plastic or other thin sheet-like material surface, wherein the pressure sensitive film is adapted to produce, in connection with a deformation of the force and/or pressure sensor, an electrical signal corresponding to the magnitude of the deformation. The rollers forming the nip are caused to rotate in relation to one another such that the nip pressure of the nip causes a deformation of the force and/or pressure sensor producing an electrical signal corresponding to the deformation of the nip. The nip pressure and/or pressure profile of the nip is calculated by using the electrical signal produced by the deformation of the force and/or pressure sensor.
IPC 8 full level
B65H 20/02 (2006.01)
CPC (source: EP)
B41F 33/0072 (2013.01); B65H 20/02 (2013.01); B65H 23/188 (2013.01); B65H 2515/314 (2013.01); B65H 2553/26 (2013.01); B65H 2801/21 (2013.01)
Citation (search report)
See references of WO 2009101251A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
WO 2009101251 A2 20090820; WO 2009101251 A3 20091203; EP 2250111 A2 20101117
DOCDB simple family (application)
FI 2009050103 W 20090210; EP 09711484 A 20090210