EP 2252463 A1 20101124 - FABRICATION OF A PRINTHEAD INTEGRATED CIRCUIT ATTACHMENT FILM BY PHOTOPATTERNING
Title (en)
FABRICATION OF A PRINTHEAD INTEGRATED CIRCUIT ATTACHMENT FILM BY PHOTOPATTERNING
Title (de)
HERSTELLUNG EINER DRUCKKOPF-IC-BEFESTIGUNGSFOLIE DURCH PHOTOSTRUKTURIERUNG
Title (fr)
FABRICATION D'UN FILM DE FIXATION DE CIRCUIT INTÉGRÉ DE TÊTE D'IMPRESSION PAR FORMATION DE MOTIFS PAR PHOTO-EXPOSITION
Publication
Application
Priority
AU 2008000380 W 20080317
Abstract (en)
[origin: WO2009114893A1] A method of fabricating a film for attachment of one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing an adhesive polymeric film, the film being comprised of one or more photopatternable materials; (b) exposing predetermined regions of the film through a mask; and (c) developing the film to define a plurality of ink supply holes.
IPC 8 full level
B41J 2/175 (2006.01); C08J 5/18 (2006.01)
CPC (source: EP)
B41J 2/16 (2013.01); B41J 2/1623 (2013.01); B41J 2/1631 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/20 (2013.01)
Citation (search report)
See references of WO 2009114893A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
WO 2009114893 A1 20090924; EP 2252463 A1 20101124; TW 200940351 A 20091001
DOCDB simple family (application)
AU 2008000380 W 20080317; EP 08714426 A 20080317; TW 97116841 A 20080507