EP 2253414 A1 20101124 - THROUGH HOLE FORMING METHOD, AND PRODUCT HAVING THROUGH HOLE
Title (en)
THROUGH HOLE FORMING METHOD, AND PRODUCT HAVING THROUGH HOLE
Title (de)
VERFAHREN ZUR BILDUNG EINER DURCHGANGSBOHRUNG UND PRODUKT MIT DER DURCHGANGSBOHRUNG
Title (fr)
PROCÉDÉ DE FORMATION DE TROU TRAVERSANT, ET PRODUIT AYANT UN TROU TRAVERSANT
Publication
Application
Priority
- JP 2009053897 W 20090302
- JP 2008047836 A 20080228
- JP 2008210680 A 20080819
Abstract (en)
A method for forming a through hole, which resolves many problems of conventional method for forming a through hole by applying laser beam and can easily control a shape of the through hole so as to form even diameters at a laser incident side and an opposite side without dependence on a shape of a work object, and form a counter-tapered hole with a diameter at the opposite side larger than that at the incident side, is provided. In the method based on a laser ablation method for forming a through hole, the laser beam is applied on a laser beam exit surface of the work object to be in contact with at least one of a colloid solution of a high-polymer material, a solution of a high-polymer material or polyol.
IPC 8 full level
B23K 26/12 (2014.01); B23K 26/18 (2006.01); B23K 26/382 (2014.01); H01S 3/00 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP US)
B23K 26/009 (2013.01 - EP US); B23K 26/18 (2013.01 - EP US); B23K 26/382 (2015.10 - EP US); B23K 26/40 (2013.01 - EP US); H05K 3/0032 (2013.01 - EP US); B23K 2103/05 (2018.07 - EP US); B23K 2103/10 (2018.07 - EP US); B23K 2103/172 (2018.07 - EP US); B23K 2103/30 (2018.07 - EP US); B23K 2103/42 (2018.07 - EP US); B23K 2103/50 (2018.07 - EP US); H05K 2203/1383 (2013.01 - EP US); Y10T 428/24273 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
EP 2253414 A1 20101124; EP 2253414 A4 20121205; CN 102015196 A 20110413; JP 2010069532 A 20100402; JP 5432547 B2 20140305; KR 101269527 B1 20130530; KR 20100126426 A 20101201; US 2011003114 A1 20110106; US 8704127 B2 20140422; WO 2009107837 A1 20090903
DOCDB simple family (application)
EP 09714475 A 20090302; CN 200980113930 A 20090302; JP 2009048579 A 20090302; JP 2009053897 W 20090302; KR 20107021112 A 20090302; US 91963009 A 20090302