Global Patent Index - EP 2256219 A4

EP 2256219 A4 20120627 - COPPER ALLOY MATERIAL

Title (en)

COPPER ALLOY MATERIAL

Title (de)

KUPFERLEGIERUNGSWERKSTOFF

Title (fr)

MATÉRIAU D'ALLIAGE DE CUIVRE

Publication

EP 2256219 A4 20120627 (EN)

Application

EP 09712614 A 20090217

Priority

  • JP 2009052718 W 20090217
  • JP 2008036694 A 20080218

Abstract (en)

[origin: EP2256219A1] A copper alloy material, containing Ni 1.8 to 5.0 mass% and Si 0.3 to 1.7 mass%, at a ratio of contents of Ni and Si, Ni/Si, of 3.0 to 6.0, and having a content of S of less than 0.005 mass%, with the balance of being Cu and inevitable impurities, wherein the copper alloy material satisfies formulae (1) to (4): 130 × C + 300 ‰¤ TS ‰¤ 130 × C + 650 0.001 ‰¤ d ‰¤ 0.020 W ‰¤ 150 10 ‰¤ L ‰¤ 800 wherein TS represents a tensile strength (MPa) of the copper alloy material in a direction parallel to rolling; C represents the content (mass%) of Ni in the copper alloy material; d represents an average grain diameter (mm) of the copper alloy material; W represents a width (nm) of a precipitate free zone; and L represents a particle diameter (nm) of a compound on a grain boundary.

IPC 8 full level

C22C 9/06 (2006.01); C22F 1/08 (2006.01); H01B 1/02 (2006.01)

CPC (source: EP US)

C22C 9/06 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US); H01B 1/026 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2256219 A1 20101201; EP 2256219 A4 20120627; CN 101946014 A 20110112; JP WO2009104615 A1 20110623; US 2010310413 A1 20101209; US 2011259480 A1 20111027; WO 2009104615 A1 20090827

DOCDB simple family (application)

EP 09712614 A 20090217; CN 200980105393 A 20090217; JP 2009052718 W 20090217; JP 2009554332 A 20090217; US 201113175068 A 20110701; US 85821710 A 20100817