EP 2259308 B1 20220615 - SUBSTRATE FOR POWER MODULE WITH HEAT SINK AND METHOD FOR PRODUCING THE SAME, POWER MODULE WITH HEAT SINK, AND SUBSTRATE FOR POWER MODULE
Title (en)
SUBSTRATE FOR POWER MODULE WITH HEAT SINK AND METHOD FOR PRODUCING THE SAME, POWER MODULE WITH HEAT SINK, AND SUBSTRATE FOR POWER MODULE
Title (de)
SUBSTRAT FÜR LEISTUNGSMODUL MIT KÜHLKÖRPER UND HERSTELLUNGSVERFAHREN DAFÜR, LEISTUNGSMODUL MIT KÜHLKÖRPER UND SUBSTRAT FÜR LEISTUNGSMODUL
Title (fr)
SUBSTRAT POUR MODULE DE PUISSANCE A DISSIPATEUR THERMIQUE ET SON PROCEDE DE FABRICATION, MODULE DE PUISSANCE A DISSIPATEUR THERMIQUE, ET SUBSTRAT POUR MODULE DE PUISSANCE
Publication
Application
Priority
- JP 2008067344 A 20080317
- JP 2008234997 A 20080912
- JP 2009054654 W 20090311
Abstract (en)
[origin: EP2259308A1] A power module substrate having a heatsink, includes: a power module substrate (11) having an insulating substrate (12) having a first face (12a) and a second face (12b), a circuit layer (13) formed on the first face (12a), and a metal layer (14) formed on the second face (12b); and a heatsink (17) directly connected to the metal layer (14), cooling the power module substrate (11), wherein a ratio B/A is in the range defined by 1.5 ¦ B/A ¦ 20, where a thickness of the circuit layer (13) is represented as A, and a thickness of the metal layer (14) is represented as B.
IPC 8 full level
H01L 23/12 (2006.01); H01L 23/373 (2006.01)
CPC (source: EP US)
H01L 23/3735 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); Y10T 29/49126 (2015.01 - EP US); Y10T 29/49227 (2015.01 - EP US)
Citation (examination)
- US 2004195294 A1 20041007 - MASUDA TSUGIO [JP]
- JP 2007311529 A 20071129 - MITSUBISHI MATERIALS CORP
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2259308 A1 20101208; EP 2259308 A4 20141105; EP 2259308 B1 20220615; CN 101971329 A 20110209; CN 101971329 B 20121121; JP 2010093225 A 20100422; JP 2010171437 A 20100805; JP 2013065918 A 20130411; JP 2013179374 A 20130909; JP 4524716 B2 20100818; JP 5434701 B2 20140305; JP 5440721 B2 20140312; JP 5613914 B2 20141029; KR 101610973 B1 20160408; KR 20100138875 A 20101231; US 2011017496 A1 20110127; US 8637777 B2 20140128; WO 2009116439 A1 20090924
DOCDB simple family (application)
EP 09721361 A 20090311; CN 200980109188 A 20090311; JP 2009054654 W 20090311; JP 2009063210 A 20090316; JP 2010053620 A 20100310; JP 2013007864 A 20130118; JP 2013129704 A 20130620; KR 20107017399 A 20090311; US 92273209 A 20090311