Global Patent Index - EP 2259308 B1

EP 2259308 B1 20220615 - SUBSTRATE FOR POWER MODULE WITH HEAT SINK AND METHOD FOR PRODUCING THE SAME, POWER MODULE WITH HEAT SINK, AND SUBSTRATE FOR POWER MODULE

Title (en)

SUBSTRATE FOR POWER MODULE WITH HEAT SINK AND METHOD FOR PRODUCING THE SAME, POWER MODULE WITH HEAT SINK, AND SUBSTRATE FOR POWER MODULE

Title (de)

SUBSTRAT FÜR LEISTUNGSMODUL MIT KÜHLKÖRPER UND HERSTELLUNGSVERFAHREN DAFÜR, LEISTUNGSMODUL MIT KÜHLKÖRPER UND SUBSTRAT FÜR LEISTUNGSMODUL

Title (fr)

SUBSTRAT POUR MODULE DE PUISSANCE A DISSIPATEUR THERMIQUE ET SON PROCEDE DE FABRICATION, MODULE DE PUISSANCE A DISSIPATEUR THERMIQUE, ET SUBSTRAT POUR MODULE DE PUISSANCE

Publication

EP 2259308 B1 20220615 (EN)

Application

EP 09721361 A 20090311

Priority

  • JP 2008067344 A 20080317
  • JP 2008234997 A 20080912
  • JP 2009054654 W 20090311

Abstract (en)

[origin: EP2259308A1] A power module substrate having a heatsink, includes: a power module substrate (11) having an insulating substrate (12) having a first face (12a) and a second face (12b), a circuit layer (13) formed on the first face (12a), and a metal layer (14) formed on the second face (12b); and a heatsink (17) directly connected to the metal layer (14), cooling the power module substrate (11), wherein a ratio B/A is in the range defined by 1.5 ‰¦ B/A ‰¦ 20, where a thickness of the circuit layer (13) is represented as A, and a thickness of the metal layer (14) is represented as B.

IPC 8 full level

H01L 23/12 (2006.01); H01L 23/373 (2006.01)

CPC (source: EP US)

H01L 23/3735 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); Y10T 29/49126 (2015.01 - EP US); Y10T 29/49227 (2015.01 - EP US)

Citation (examination)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2259308 A1 20101208; EP 2259308 A4 20141105; EP 2259308 B1 20220615; CN 101971329 A 20110209; CN 101971329 B 20121121; JP 2010093225 A 20100422; JP 2010171437 A 20100805; JP 2013065918 A 20130411; JP 2013179374 A 20130909; JP 4524716 B2 20100818; JP 5434701 B2 20140305; JP 5440721 B2 20140312; JP 5613914 B2 20141029; KR 101610973 B1 20160408; KR 20100138875 A 20101231; US 2011017496 A1 20110127; US 8637777 B2 20140128; WO 2009116439 A1 20090924

DOCDB simple family (application)

EP 09721361 A 20090311; CN 200980109188 A 20090311; JP 2009054654 W 20090311; JP 2009063210 A 20090316; JP 2010053620 A 20100310; JP 2013007864 A 20130118; JP 2013129704 A 20130620; KR 20107017399 A 20090311; US 92273209 A 20090311