EP 2260508 A1 20101215 - SELF-ASSEMBLY OF CHIPS BY SUBSTRATE
Title (en)
SELF-ASSEMBLY OF CHIPS BY SUBSTRATE
Title (de)
SELBSTANORDNUNG VON CHIPS MITHILFE EINES SUBSTRATS
Title (fr)
AUTO-ASSEMBLAGE DE PUCES SUR UN SUBSTRAT
Publication
Application
Priority
- EP 2009054115 W 20090407
- FR 0852370 A 20080409
Abstract (en)
[origin: WO2009124921A1] The invention relates to a method of forming, on the surface of a substrate (2), at least one hydrophilic attachment zone (12) for the purpose of self-assembling a component or a chip (3), in which a hydrophobic zone (20), which delimits said hydrophilic attachment zone, is produced.
IPC 8 full level
H01L 21/58 (2006.01); H01L 21/60 (2006.01); H01L 21/98 (2006.01)
CPC (source: EP US)
H01L 24/24 (2013.01 - EP US); H01L 24/29 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H01L 24/90 (2013.01 - EP US); H01L 24/95 (2013.01 - EP US); H01L 25/50 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/08235 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/16235 (2013.01 - EP US); H01L 2224/24011 (2013.01 - EP US); H01L 2224/24226 (2013.01 - EP US); H01L 2224/2919 (2013.01 - EP US); H01L 2224/32145 (2013.01 - EP US); H01L 2224/80004 (2013.01 - EP US); H01L 2224/80143 (2013.01 - EP US); H01L 2224/81136 (2013.01 - EP US); H01L 2224/81143 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2224/81894 (2013.01 - EP US); H01L 2224/83002 (2013.01 - EP); H01L 2224/83141 (2013.01 - EP US); H01L 2224/83143 (2013.01 - EP US); H01L 2224/83192 (2013.01 - EP US); H01L 2224/8385 (2013.01 - EP US); H01L 2224/83894 (2013.01 - EP US); H01L 2224/9202 (2013.01 - EP US); H01L 2224/95085 (2013.01 - EP US); H01L 2224/95146 (2013.01 - EP US); H01L 2225/06562 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01049 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/10156 (2013.01 - EP); H01L 2924/10157 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/10329 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/1461 (2013.01 - EP US); H01L 2924/15192 (2013.01 - EP US)
Citation (search report)
See references of WO 2009124921A1
Citation (examination)
- WO 2006077739 A1 20060727 - KOYANAGI MITSUMASA [JP] & US 2009023243 A1 20090122 - KOYANAGI MITSUMASA [JP]
- US 6204079 B1 20010320 - ASPAR BERNARD [FR], et al
- US 2002009593 A1 20020124 - VEERASAMY VIJAYEN S [US]
- SCHULZ H ET AL: "Ultra hydrophobic wetting behaviour of amorphous carbon films", SURFACE AND COATINGS TECHNOLOGY, vol. 200, no. 1, 8 March 2005 (2005-03-08), pages 1123 - 1126, XP029229705, ISSN: 0257-8972, DOI: 10.1016/J.SURFCOAT.2005.02.019
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
WO 2009124921 A1 20091015; EP 2260508 A1 20101215; FR 2929864 A1 20091016; FR 2929864 B1 20200207; JP 2011517104 A 20110526; JP 5656825 B2 20150121; US 2011033976 A1 20110210; US 8642391 B2 20140204
DOCDB simple family (application)
EP 2009054115 W 20090407; EP 09731239 A 20090407; FR 0852370 A 20080409; JP 2011503417 A 20090407; US 93676509 A 20090407