EP 2264114 A3 20110525 - Use of carbon acid hydracide to unstick polyurethane adhesives
Title (en)
Use of carbon acid hydracide to unstick polyurethane adhesives
Title (de)
Verwendung von Carbonsäurehydrazid zum Entkleben von Polyurethanklebstoffen
Title (fr)
Utilisation d'hydracide d'acide de carbone pour le décollage de colles de polyuréthane
Publication
Application
Priority
EP 09163248 A 20090619
Abstract (en)
[origin: EP2264114A2] Use of carboxylic acid hydrazides (5) for debonding an adhesive bond comprising a cured, carboxylic acid hydrazide containing polyurethane adhesive (4'), is claimed. Independent claims are included for: (1) a method of debonding an adhesive bond comprising heating a cured, a carboxylic acid hydrazide containing polyurethane adhesive at a debonding temperature of at least 80[deg] C; (2) a curable composition (II) comprising at least one polyisocyanate and the carboxylic acid hydrazide, where the ratio (nHY-nAK)nNCO exhibits a value of 0.2-3, preferably 0.5-2, where nHY is a number of hydrazide present in (II), nAk is a number of aldehyde and keto groups present in or released in (II), and nNCO is a number of isocyanate groups present in (II); (3) a cured composition (III) comprising carboxylic acid hydrazide, which is obtained by curing (II) at a temperature of below 80[deg] C, preferably below 60[deg] C; (4) a composite body (1) comprising a substrate S1 (2), a substrate S2 (3) and (III), located between S1 and S2 and by which S1 and S2 are bonded together; and (5) a repair process comprising (a) heating the cured polyurethane adhesive of the composite body at at least 80[deg] C, preferably 120-240?C, for debonding the adhesive bond as a result of heat-initiated thermal degradation of the cured polyurethane adhesive, (b) removing S2 from the composite body, (c) subsequently removing the remaining residues of the thermally degraded polyurethane adhesive on S2, (d) optionally cleaning and/or pretreating S1, and carrying out the steps (e) and (f) or (e1) and (f1), (e) applying the repaired adhesive of step (c) or (d) on S1, (f) contacting the repaired adhesive with S2, (e1) subsequently applying the repaired adhesive on S2 and (f1) contacting the repaired adhesive with S1.
IPC 8 full level
C09J 175/00 (2006.01); C08K 5/00 (2006.01); C08K 5/25 (2006.01); C09J 5/00 (2006.01)
CPC (source: EP KR US)
C08G 18/10 (2013.01 - EP US); C08K 5/00 (2013.01 - KR); C08K 5/25 (2013.01 - KR); C09J 5/00 (2013.01 - EP KR US); C09J 175/04 (2013.01 - KR); C09J 175/12 (2013.01 - EP US); C08K 5/25 (2013.01 - EP US); C08L 75/04 (2013.01 - EP US); C09J 2301/502 (2020.08 - EP US); Y10T 428/31551 (2015.04 - EP US)
Citation (search report)
- [X] EP 2062926 A1 20090527 - SIKA TECHNOLOGY AG [CH]
- [A] WO 2005028583 A1 20050331 - RESCOLL [FR], et al
- [A] US 3485778 A 19691223 - OERTEL HARALD, et al
- [E] EP 2098569 A1 20090909 - POLYPLASTICS CO [JP]
- [X] US 3575894 A 19710420 - ZORN BRUNO, et al
- [E] EP 2072550 A1 20090624 - SIKA TECHNOLOGY AG [CH]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
EP 2264114 A2 20101222; EP 2264114 A3 20110525; BR PI1011603 A2 20160315; CN 102803421 A 20121128; JP 2012530173 A 20121129; KR 20120046123 A 20120509; US 2010323202 A1 20101223; WO 2010146144 A2 20101223; WO 2010146144 A3 20111110
DOCDB simple family (application)
EP 09163248 A 20090619; BR PI1011603 A 20100618; CN 201080032287 A 20100618; EP 2010058596 W 20100618; JP 2012515507 A 20100618; KR 20117031393 A 20100618; US 81973110 A 20100621