Global Patent Index - EP 2265746 A2

EP 2265746 A2 20101229 - METHOD AND DISPERSION FOR APPLYING A METAL LAYER TO A SUBSTRATE AND METALLIZABLE THERMOPLASTIC MOLDING COMPOUND

Title (en)

METHOD AND DISPERSION FOR APPLYING A METAL LAYER TO A SUBSTRATE AND METALLIZABLE THERMOPLASTIC MOLDING COMPOUND

Title (de)

VERFAHREN UND DISPERSION ZUM AUFBRINGEN EINER METALLSCHICHT AUF EINEM SUBSTRAT SOWIE METALLISIERBARE THERMOPLASTISCHE FORMMASSE

Title (fr)

PROCÉDÉ ET DISPERSION POUR L'APPLICATION D'UNE COUCHE MÉTALLIQUE SUR UN SUBSTRAT, ET MATIÈRE THERMOPLASTIQUE POUR MOULAGE MÉTALLISABLE

Publication

EP 2265746 A2 20101229 (DE)

Application

EP 09719826 A 20090313

Priority

  • EP 2009052990 W 20090313
  • EP 08152712 A 20080313
  • EP 09719826 A 20090313

Abstract (en)

[origin: WO2009112573A2] The invention relates to a method for applying a metal layer to a substrate by deposition of a metal from a metallic salt solution, characterized in that the substrate surface comprises exfoliated graphite.

IPC 8 full level

C23C 18/54 (2006.01); C23C 18/16 (2006.01)

CPC (source: EP KR US)

C23C 18/16 (2013.01 - KR); C23C 18/1641 (2013.01 - EP US); C23C 18/2053 (2013.01 - EP US); C23C 18/31 (2013.01 - EP US); C25D 5/54 (2013.01 - EP KR US); C25D 5/56 (2013.01 - EP KR US); H05K 3/181 (2013.01 - EP US); H05K 3/188 (2013.01 - EP US); H05K 3/387 (2013.01 - EP US); H05K 1/0373 (2013.01 - EP US); H05K 1/0393 (2013.01 - EP US); H05K 2201/0129 (2013.01 - EP US); H05K 2201/0323 (2013.01 - EP US); Y10T 428/12569 (2015.01 - EP US); Y10T 428/31678 (2015.04 - EP US)

Citation (search report)

See references of WO 2009112573A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

WO 2009112573 A2 20090917; WO 2009112573 A3 20100225; CN 101970720 A 20110209; CN 101970720 B 20141015; EP 2265746 A2 20101229; JP 2011513567 A 20110428; JP 5575669 B2 20140820; KR 20100126505 A 20101201; US 2011014492 A1 20110120

DOCDB simple family (application)

EP 2009052990 W 20090313; CN 200980108693 A 20090313; EP 09719826 A 20090313; JP 2010550208 A 20090313; KR 20107022917 A 20090313; US 92242109 A 20090313