EP 2266376 A2 20101229 - METHOD FOR PRODUCING CIRCUIT CARRIERS
Title (en)
METHOD FOR PRODUCING CIRCUIT CARRIERS
Title (de)
VERFAHREN ZUR HERSTELLUNG VON SCHALTUNGSTRÄGERN
Title (fr)
PROCÉDÉ DE PRODUCTION DE SUPPORTS DE CIRCUITS
Publication
Application
Priority
- DE 2009000115 W 20090128
- DE 102008014690 A 20080318
Abstract (en)
[origin: WO2009115069A2] The invention relates to a method for the automated production of circuit carriers, comprising the following steps: - providing a substrate (1) for accommodating electronic components (2), - applying an electrically conductive, metal-containing base structure (3) on the substrate (1), electronic components (2) on the substrate (1) being connected to each other by said structure, and - applying electrically conductive, metal-containing conductive adhesive structures (4) onto the substrate (1), the electronic components (2) being connected to the base structure (3) in an electrically conductive way by said structures. To this end, for the automated optical monitoring of the electrically conductive, metal-containing conductive adhesive structures (4) and the electrically conductive, metal-containing base structure (3), the conductive adhesive structures (4) are optically differentiated from the base structure (3) in that a colored electrically conductive, metal-containing conductive adhesive is applied onto the substrate (1) in order to produce a conductive adhesive structure such that a contrast, which is necessary for the automated optical monitoring of the conductive adhesive structures (4) and the base structure (3), is established between the conductive adhesive structures (4) and the base structure (3).
IPC 8 full level
CPC (source: EP US)
C09J 9/02 (2013.01 - EP US); C09J 11/04 (2013.01 - EP US); H05K 1/0269 (2013.01 - EP US); H05K 3/321 (2013.01 - EP US); C08K 3/08 (2013.01 - EP US); H05K 2203/0315 (2013.01 - EP US); H05K 2203/161 (2013.01 - EP US); Y10T 156/10 (2015.01 - EP US)
Citation (search report)
See references of WO 2009115069A2
Citation (examination)
- JP S61186191 A 19860819 - NEC CORP
- DE 102004022232 A1 20051201 - INFINEON TECHNOLOGIES AG [DE]
- US 6232866 B1 20010515 - JAVADI HAMID [US]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
DE 102008014690 A1 20090924; DE 112009000077 A5 20100916; EP 2266376 A2 20101229; JP 2011519474 A 20110707; US 2011048640 A1 20110303; WO 2009115069 A2 20090924; WO 2009115069 A3 20091112
DOCDB simple family (application)
DE 102008014690 A 20080318; DE 112009000077 T 20090128; DE 2009000115 W 20090128; EP 09723282 A 20090128; JP 2011502220 A 20090128; US 92271209 A 20090128