EP 2267172 A1 20101229 - COPPER ALLOY MATERIAL FOR ELECTRIC AND ELECTRONIC COMPONENTS
Title (en)
COPPER ALLOY MATERIAL FOR ELECTRIC AND ELECTRONIC COMPONENTS
Title (de)
KUPFERLEGIERUNGSMATERIAL FÜR ELEKTRISCHE UND ELEKTRONISCHE BAUTEILE
Title (fr)
MATÉRIAU D'ALLIAGE DU CUIVRE POUR COMPOSANTS ÉLECTRIQUES ET ÉLECTRONIQUES
Publication
Application
Priority
- JP 2009055531 W 20090319
- JP 2008074650 A 20080321
Abstract (en)
A copper alloy material for an electric/electronic part, containing Co 0.5 to 2.5 mass% and Si 0.1 to 1.0 mass%, at a ratio of Co/Si of 3 to 5 in terms of mass ratio, with the balance of Cu and inevitable impurities, which is obtained by subjecting to a solution treatment at a temperature (°C) from 800°C to 960°C and lower than -122.77X 2 + 409.99X + 615.74, in which X represents the Co content in mass%.
IPC 8 full level
C22C 9/06 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01); H01B 1/02 (2006.01)
CPC (source: EP US)
C22C 9/06 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US); H01B 1/026 (2013.01 - EP US)
Citation (search report)
See references of WO 2009116649A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
EP 2267172 A1 20101229; CN 101978081 A 20110216; CN 101978081 B 20140910; JP 5065478 B2 20121031; JP WO2009116649 A1 20110721; US 2011005644 A1 20110113; WO 2009116649 A1 20090924
DOCDB simple family (application)
EP 09722228 A 20090319; CN 200980110059 A 20090319; JP 2009055531 W 20090319; JP 2010503942 A 20090319; US 88626810 A 20100920