EP 2267799 A1 20101229 - LIGHT-EMITTING DIODE PACKAGE
Title (en)
LIGHT-EMITTING DIODE PACKAGE
Title (de)
LICHTEMITTIERENDES DIODENPAKET
Title (fr)
ENSEMBLE DIODE ELECTROLUMINESCENTE
Publication
Application
Priority
- JP 2009056976 W 20090403
- JP 2008108953 A 20080418
Abstract (en)
To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate. A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO 2 , from 13 to 18% of B 2 O 3 , from 9 to 23% of CaO, from 3 to 8% of Al 2 O 3 and from 0.5 to 6% of at least one of K 2 O and Na 2 O in total, and a ceramic filler.
IPC 8 full level
H01L 33/00 (2010.01); H01L 23/12 (2006.01); H01L 23/15 (2006.01); H01L 23/36 (2006.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01)
CPC (source: EP US)
C03C 14/004 (2013.01 - EP US); C04B 35/117 (2013.01 - EP US); C04B 35/119 (2013.01 - EP US); H01L 23/3677 (2013.01 - EP US); H01L 33/486 (2013.01 - EP US); H01L 33/641 (2013.01 - EP US); C04B 2235/36 (2013.01 - EP US); C04B 2235/6025 (2013.01 - EP US); C04B 2235/96 (2013.01 - EP US); H01L 33/642 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H05K 1/0206 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US)
Citation (search report)
See references of WO 2009128354A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
EP 2267799 A1 20101229; CN 102007609 A 20110406; CN 102007609 B 20130123; JP 2012229160 A 20121122; JP 5061236 B2 20121031; JP 5668730 B2 20150212; JP WO2009128354 A1 20110804; KR 20100135223 A 20101224; TW 201006012 A 20100201; US 2011001162 A1 20110106; US 8309974 B2 20121113; WO 2009128354 A1 20091022
DOCDB simple family (application)
EP 09733229 A 20090403; CN 200980113720 A 20090403; JP 2009056976 W 20090403; JP 2010508173 A 20090403; JP 2012169164 A 20120731; KR 20107017068 A 20090403; TW 98111369 A 20090406; US 88120410 A 20100914