EP 2268434 A1 20110105 - A METHOD FOR MAKING COMPOSITE SPUTTERING TARGETS AND THE TARGETS MADE IN ACCORDANCE WITH THE METHOD
Title (en)
A METHOD FOR MAKING COMPOSITE SPUTTERING TARGETS AND THE TARGETS MADE IN ACCORDANCE WITH THE METHOD
Title (de)
VERFAHREN ZUR HERSTELLUNG VON VERBUNDSTOFF-SPUTTER-TARGETS UND GEMÄSS DEM VERFAHREN HERGESTELLTE TARGETS
Title (fr)
PROCÉDÉ POUR FABRIQUER DES CIBLES DE PULVÉRISATION CATHODIQUE COMPOSITES ET CIBLES FABRIQUÉES SELON LE PROCÉDÉ
Publication
Application
Priority
- US 2009000646 W 20090129
- US 7012508 P 20080320
- US 31975409 A 20090112
Abstract (en)
[origin: WO2009117043A1] Composite sputtering targets are made by hot pressing metal or metal containing powders into a backing plate which can be comprised of a different material with a depression formed in a surface or can be a used sputtering target of the same or different material. The depression corresponds to the erosion pattern of a target having the same geometry. The depression can be formed for example, by machining. The backing plate is loaded into a graphite die and covered with the sputtering material to form an assembly. A ram is added and the assembly with the ram is loaded into a hot press which is taken to an appropriate pressure and temperature under vacuum to form a composite sputtering target having a sputtering zone of densified sputtering material.
IPC 8 full level
CPC (source: EP)
B22F 7/08 (2013.01); B32B 15/018 (2013.01); C22C 1/0466 (2013.01); C22C 5/04 (2013.01); B22F 2003/145 (2013.01); B22F 2003/247 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01)
Citation (search report)
See references of WO 2009117043A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
WO 2009117043 A1 20090924; EP 2268434 A1 20110105; JP 2011517730 A 20110616; TW 200940216 A 20091001
DOCDB simple family (application)
US 2009000646 W 20090129; EP 09723334 A 20090129; JP 2011500765 A 20090129; TW 98104770 A 20090213