Global Patent Index - EP 2269168 A1

EP 2269168 A1 20110105 - CHIP CARD, AND METHOD FOR THE PRODUCTION THEREOF

Title (en)

CHIP CARD, AND METHOD FOR THE PRODUCTION THEREOF

Title (de)

CHIPKARTE UND VERFAHREN ZU DEREN HERSTELLUNG

Title (fr)

CARTE À PUCE ET SON PROCÉDÉ DE FABRICATION

Publication

EP 2269168 A1 20110105 (DE)

Application

EP 09732963 A 20090414

Priority

  • EP 2009002732 W 20090414
  • DE 102008019571 A 20080418

Abstract (en)

[origin: WO2009127395A1] The invention relates to a chip card in the form of an ID-1 card, a plug-in SIMs, or a USB token, comprising a layered composite (12) having two (4, 5) or three (4, 5, 9) layers extending across the entire chip card (1). For this purpose an exterior film layer (4) has a communication contact layout (2) on the front (4a) thereof facing toward the exterior (4b), and a flip chip (7) on the back thereof, and a flip chip contact layout (6) being connected to the front communication contact layout (2) in an electrically conducting manner.

IPC 8 full level

G06K 19/077 (2006.01)

CPC (source: EP US)

G06K 19/07718 (2013.01 - EP US); G06K 19/07732 (2013.01 - EP US); G06K 19/07743 (2013.01 - EP US); G06K 19/07769 (2013.01 - EP US); H01L 24/16 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/19042 (2013.01 - EP US)

Citation (search report)

See references of WO 2009127395A1

Citation (examination)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

DE 102008019571 A1 20091022; CN 102007503 A 20110406; CN 102007503 B 20131030; EP 2269168 A1 20110105; US 2011042830 A1 20110224; US 2012112367 A1 20120510; US 8313981 B2 20121120; US 8390132 B2 20130305; WO 2009127395 A1 20091022

DOCDB simple family (application)

DE 102008019571 A 20080418; CN 200980113644 A 20090414; EP 09732963 A 20090414; EP 2009002732 W 20090414; US 201213352792 A 20120118; US 98802909 A 20090414