EP 2269213 A1 20110105 - METHOD FOR PRODUCING A HERMETICALLY SEALED, ELECTRICAL FEEDTHROUGH USING EXOTHERMIC NANOFILM
Title (en)
METHOD FOR PRODUCING A HERMETICALLY SEALED, ELECTRICAL FEEDTHROUGH USING EXOTHERMIC NANOFILM
Title (de)
VERFAHREN ZUR ERZEUGUNG EINER HERMETISCH DICHTEN, ELEKTRISCHEN DURCHFÜHRUNG MITTELS EXOTHERMER NANOFOLIE
Title (fr)
PROCÉDÉ DE PRODUCTION D'UNE TRAVERSÉE ÉLECTRIQUE HERMÉTIQUEMENT ÉTANCHE À L'AIDE D'UN NANOFILM EXOTHERME
Publication
Application
Priority
- EP 2009055131 W 20090428
- DE 102008021167 A 20080428
Abstract (en)
[origin: WO2009133105A1] The present invention relates to a method for generating at least one electrical connection (1) from at least one electronic component (7), which is positioned on a substrate (3) inside an encapsulation (5), to outside the encapsulation (5). The functional capability of the electrical connection (1) is to be provided at ambient temperatures greater than 140°C and in the event of large power losses and extreme environmental influences. The invention is characterized in that a reactive nanofilm (2), having targeted reaction, which can be triggered exothermically by laser, is used to produce hermetically sealed electrical connections (1). Using the nanofilm (2), an output of an electrical connection (1) and a contact of the electrical connection (1) to at least one further electrical contact can be provided.
IPC 8 full level
H01L 21/60 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); B23K 35/34 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/055 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP US)
B23K 1/0006 (2013.01 - EP US); B23K 35/0233 (2013.01 - EP US); B23K 35/3006 (2013.01 - EP US); B23K 35/34 (2013.01 - EP US); H01L 21/56 (2013.01 - EP US); H01L 23/055 (2013.01 - EP US); H01L 23/3121 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); B23K 2101/40 (2018.07 - EP US); H01L 24/29 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 2224/29083 (2013.01 - EP US); H01L 2224/291 (2013.01 - EP US); H01L 2224/29124 (2013.01 - EP US); H01L 2224/83232 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01049 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/0781 (2013.01 - EP US); H01L 2924/07811 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/16152 (2013.01 - EP US); H01L 2924/166 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US)
Citation (search report)
See references of WO 2009133105A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
WO 2009133105 A1 20091105; CN 102017110 A 20110413; CN 102017110 B 20120627; DE 102008021167 B3 20100121; EP 2269213 A1 20110105; US 2011049729 A1 20110303; US 8227297 B2 20120724
DOCDB simple family (application)
EP 2009055131 W 20090428; CN 200980115169 A 20090428; DE 102008021167 A 20080428; EP 09738149 A 20090428; US 73666909 A 20090428