Global Patent Index - EP 2270242 A1

EP 2270242 A1 20110105 - COPPER ALLOY MATERIAL FOR ELECTRIC OR ELECTRONIC APPARATUSES, METHOD FOR PRODUCING IT AND COMPONENT

Title (en)

COPPER ALLOY MATERIAL FOR ELECTRIC OR ELECTRONIC APPARATUSES, METHOD FOR PRODUCING IT AND COMPONENT

Title (de)

KUPFERLEGIERUNGSMATERIAL FÜR ELEKTRISCHE ODER ELEKTRONISCHE VORRICHTUNGEN, VERFAHREN ZU DESSEN HERSTELLUNG UND BAUTEIL

Title (fr)

MATÉRIAU D'ALLIAGE DE CUIVRE DESTINÉ À DES APPAREILS ÉLECTRIQUES OU ÉLECTRONIQUES, PROCÉDÉ DE SON FABRICATION ET COMPOSANT

Publication

EP 2270242 A1 20110105 (EN)

Application

EP 09728058 A 20090330

Priority

  • JP 2009056576 W 20090330
  • JP 2008092315 A 20080331

Abstract (en)

A copper alloy material for an electrical/electronic equipment, containing Ni 3.3 to 5.0 mass%, having a content of Si within the range of 2.8 to 3.8 in terms of a mass ratio of Ni and Si (Ni/Si), and containing Mg 0.01 to 0.2 mass%, Sn 0.05 to 1.5 mass%, and Zn 0.2 to 1.5 mass%, with the balance of Cu and inevitable impurities, wherein when a test piece with thickness t of 0.20 mm and width w of 2.0 mm is subjected to 90° W-bending with bending radius R of 0.1 mm, no cracks occur on the test piece; and, an electrical/electronic part obtained by working the same.

IPC 8 full level

C22C 9/06 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01); H01B 1/02 (2006.01); H01B 13/00 (2006.01); H01L 23/48 (2006.01)

CPC (source: EP US)

C22C 9/06 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US); H01B 1/026 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

EP 2270242 A1 20110105; EP 2270242 A4 20120627; EP 2270242 B1 20140604; CN 101981213 A 20110223; CN 101981213 B 20121114; JP 4653240 B2 20110316; JP WO2009123159 A1 20110728; KR 101114116 B1 20120313; KR 20100132044 A 20101216; US 2011017357 A1 20110127; WO 2009123159 A1 20091008

DOCDB simple family (application)

EP 09728058 A 20090330; CN 200980111781 A 20090330; JP 2009056576 W 20090330; JP 2009536501 A 20090330; KR 20107023904 A 20090330; US 89389310 A 20100929