EP 2272085 A2 20110112 - METHOD FOR FORMING A PRIMING LAYER FOR DEPOSITING A METAL ON A SUBSTRATE
Title (en)
METHOD FOR FORMING A PRIMING LAYER FOR DEPOSITING A METAL ON A SUBSTRATE
Title (de)
VERFAHREN ZUM BILDEN EINER VORBEREITUNGSSCHICHT ZUM ABSCHEIDEN EINES METALLS AUF EINEM SUBSTRAT
Title (fr)
PROCEDE DE FORMATION D'UNE COUCHE D'AMORCAGE DE DEPOT D'UN METAL SUR UN SUBSTRAT
Publication
Application
Priority
- FR 2009050524 W 20090330
- FR 0852045 A 20080328
Abstract (en)
[origin: WO2009125143A2] The invention relates to a method for forming, on a substrate (5), a priming layer enabling a subsequent deposit of a layer of a metal, which comprises immersing the substrate in a bath (7) including a material in the ethoxysilanes or siloxanes families and a copper or nickel amidinate.
IPC 8 full level
C23C 18/38 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01)
CPC (source: EP US)
C23C 18/168 (2013.01 - EP US); C23C 18/1682 (2013.01 - EP US); C23C 18/1696 (2013.01 - EP US); C23C 18/1698 (2013.01 - EP US); C23C 18/1889 (2013.01 - EP US); C23C 18/208 (2013.01 - EP US); H01L 21/288 (2013.01 - EP US); H01L 21/76873 (2013.01 - EP US); H01L 21/76874 (2013.01 - EP US)
Citation (search report)
See references of WO 2009125143A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
FR 2929449 A1 20091002; CN 101981663 A 20110223; CN 101981663 B 20120905; EP 2272085 A2 20110112; US 2011117271 A1 20110519; US 9093381 B2 20150728; WO 2009125143 A2 20091015; WO 2009125143 A3 20091210
DOCDB simple family (application)
FR 0852045 A 20080328; CN 200980111161 A 20090330; EP 09729442 A 20090330; FR 2009050524 W 20090330; US 93518609 A 20090330