EP 2272090 A2 20110112 - SUBSTRATE-MOUNTED CIRCUIT MODULE COMPRISING COMPONENTS IN A PLURALITY OF CONTACT PLANES
Title (en)
SUBSTRATE-MOUNTED CIRCUIT MODULE COMPRISING COMPONENTS IN A PLURALITY OF CONTACT PLANES
Title (de)
SUBSTRAT-SCHALTUNGSMODUL MIT BAUTEILEN IN MEHREREN KONTAKTIERUNGSEBENEN
Title (fr)
MODULE DE CIRCUIT A SUBSTRAT PRESENTANT DES COMPOSANTS DANS PLUSIEURS PLANS DE CONTACT
Publication
Application
Priority
- EP 2009053914 W 20090402
- DE 102008001414 A 20080428
Abstract (en)
[origin: WO2009132922A2] The invention relates to circuit module comprising components that are mounted on a substrate (10). Said substrate (10) comprises a metal carrier layer (20) having a first surface, a first insulating layer (30) directly adjoining the carrier layer (20) being arranged on said first surface. The substrate furthermore comprises a first wiring layer (40) which directly adjoins the first insulating layer (30), which is electroconductive and which is arranged on the first insulating layer (30). The substrate (10) comprises a first contact plane extending along the first surface, at least one of the components being directly electrically connected to the carrier layer (20) in the first contact plane. The invention further relates to a method for producing a circuit module according to the invention, wherein a surface section of the wiring layer (40) and a surface section of the underlying insulating layer (30) are removed and a component is fitted into the recess so produced.
IPC 8 full level
H01L 23/367 (2006.01); H01L 25/065 (2006.01)
CPC (source: EP US)
H01L 23/142 (2013.01 - EP US); H01L 23/3677 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 25/072 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/45015 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48137 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48472 (2013.01 - EP US); H01L 2224/49 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01042 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01052 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/1301 (2013.01 - EP US); H01L 2924/13033 (2013.01 - EP US); H01L 2924/13034 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US); Y10T 29/49162 (2015.01 - EP US)
Citation (search report)
See references of WO 2009132922A2
Citation (examination)
- WO 9510853 A1 19950420 - OLIN CORP [US]
- US 5328079 A 19940712 - MATHEW RANJAN J [US], et al
- US 2005287701 A1 20051229 - HUANG YAO-TING [TW]
- DE 102004027186 B3 20051020 - EUPEC GMBH & CO KG [DE]
- DE 19714470 A1 19971211 - HEWLETT PACKARD CO [US]
- US 2002149102 A1 20021017 - HASHEMI HASSAN S [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
DE 102008001414 A1 20091029; CN 102017135 A 20110413; CN 102017135 B 20140806; EP 2272090 A2 20110112; US 2011100681 A1 20110505; WO 2009132922 A2 20091105; WO 2009132922 A3 20091230
DOCDB simple family (application)
DE 102008001414 A 20080428; CN 200980115077 A 20090402; EP 09737966 A 20090402; EP 2009053914 W 20090402; US 73661109 A 20090402