Global Patent Index - EP 2273622 A1

EP 2273622 A1 20110112 - METALLIC MATERIAL FOR CONNECTOR AND PROCESS FOR PRODUCING THE METALLIC MATERIAL FOR CONNECTOR

Title (en)

METALLIC MATERIAL FOR CONNECTOR AND PROCESS FOR PRODUCING THE METALLIC MATERIAL FOR CONNECTOR

Title (de)

METALLMATERIAL FÜR EINEN VERBINDER UND PROZESS ZUR HERSTELLUNG DES METALLMATERIALS FÜR EINEN VERBINDER

Title (fr)

MATÉRIAU MÉTALLIQUE POUR CONNECTEUR ET PROCÉDÉ DE PRODUCTION DE MATÉRIAU MÉTALLIQUE POUR CONNECTEUR

Publication

EP 2273622 A1 20110112 (EN)

Application

EP 09723255 A 20090318

Priority

  • JP 2009055358 W 20090318
  • JP 2008072545 A 20080319
  • JP 2008072546 A 20080319

Abstract (en)

A metallic material for a connector, having a base material of a bar material or a rectangular wire material formed of copper or a copper alloy, in which a striped copper-tin alloy layer is formed in the longitudinal direction of the metallic material on a part of the surface of the metallic material, and in which a tin layer or a tin alloy layer is formed on the remaining part of the surface of the metallic material; and, a method of producing a metallic material for a connector, containing: providing a bar material or a rectangular wire material of copper or a copper alloy as a base material; forming a tin plating layer or a tin alloy plating layer on the base material, to obtain an intermediate material; and subjecting the intermediate material to reflow treatment in a stripe form in the longitudinal direction of the intermediate material.

IPC 8 full level

H01R 13/03 (2006.01); C25D 5/50 (2006.01); C25D 7/00 (2006.01); H01R 43/16 (2006.01)

CPC (source: EP US)

C25D 5/10 (2013.01 - EP US); C25D 5/505 (2013.01 - EP); C25D 5/627 (2020.08 - EP US); C25D 7/0614 (2013.01 - EP); H01R 13/03 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

EP 2273622 A1 20110112; EP 2273622 A4 20110706; CN 101978562 A 20110216; CN 101978562 B 20130403; WO 2009116601 A1 20090924

DOCDB simple family (application)

EP 09723255 A 20090318; CN 200980109514 A 20090318; JP 2009055358 W 20090318