EP 2275582 A4 20140820 - BRASS ALLOY POWDER, BRASS ALLOY EXTRUDED MATERIAL AND METHOD FOR PRODUCING THE BRASS ALLOY EXTRUDED MATERIAL
Title (en)
BRASS ALLOY POWDER, BRASS ALLOY EXTRUDED MATERIAL AND METHOD FOR PRODUCING THE BRASS ALLOY EXTRUDED MATERIAL
Title (de)
MESSINGLEGIERUNGSPULVER, EXTRUDIERTES MESSINGLEGIERUNGSMATERIAL UND VERFAHREN ZUR HERSTELLUNG DES EXTRUDIERTEN MESSINGLEGIERUNGSMATERIALS
Title (fr)
POUDRE DE LAITON SPÉCIAL, MATIÈRE EXTRUDÉE DE LAITON SPÉCIAL ET PROCÉDÉ POUR LA FABRICATION DE LA MATIÈRE EXTRUDÉE DE LAITON SPÉCIAL
Publication
Application
Priority
- JP 2009058142 W 20090424
- JP 2008121475 A 20080507
Abstract (en)
[origin: EP2275582A1] Brass alloy powder has a brass composition formed by a mixed phase of ±-phase and ²-phase, and contains 0.5 to 5.0 mass% of chromium. The chromium includes a component that is solid-solved in a mother phase of brass, and a component that is precipitated at crystal grain boundaries.
IPC 8 full level
B22F 9/08 (2006.01); B21C 23/00 (2006.01); B21C 23/01 (2006.01); B22F 1/00 (2006.01); B22F 3/20 (2006.01); C22C 1/04 (2006.01); C22C 9/04 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01)
CPC (source: EP US)
B21C 23/002 (2013.01 - EP US); C22C 1/0425 (2013.01 - EP US); C22C 9/04 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US); B22F 2998/10 (2013.01 - EP US)
C-Set (source: EP US)
Citation (search report)
- [I] JP H07118777 A 19950509 - TAIHO KOGYO CO LTD, et al
- [I] US 4285739 A 19810825 - DERUYTTERE ANDRE E A, et al
- [I] WO 2007013428 A1 20070201 - SAN ETSU METALS CO LTD [JP], et al & US 2009092517 A1 20090409 - KOSAKA YOSHIHARU [JP], et al
- [IA] JP S6213549 A 19870122 - HITACHI LTD
- [A] JP H0853725 A 19960227 - TAIHO KOGYO CO LTD
- See also references of WO 2009136552A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2275582 A1 20110119; EP 2275582 A4 20140820; CN 102016089 A 20110413; CN 102016089 B 20120822; JP 5376604 B2 20131225; JP WO2009136552 A1 20110908; US 2011056591 A1 20110310; WO 2009136552 A1 20091112
DOCDB simple family (application)
EP 09742676 A 20090424; CN 200980116310 A 20090424; JP 2009058142 W 20090424; JP 2010511043 A 20090424; US 99125909 A 20090424