Global Patent Index - EP 2277196 A1

EP 2277196 A1 20110126 - ELECTRICAL BOND CONNECTION ARRANGEMENT

Title (en)

ELECTRICAL BOND CONNECTION ARRANGEMENT

Title (de)

ELEKTRISCHE BONDVERBINDUNGSANORDNUNG

Title (fr)

AGENCEMENT ÉLECTRIQUE DE CONNEXION PAR LIAISON

Publication

EP 2277196 A1 20110126 (DE)

Application

EP 09741955 A 20090403

Priority

  • EP 2009053987 W 20090403
  • DE 102008001671 A 20080509

Abstract (en)

[origin: WO2009135737A1] The invention relates to an electrical bond connection arrangement between a first electrical contact surface and a second electrical contact surface, having at least one first electric conductor, which is bonded onto at least one of the contact surfaces by way of at least one first bond connection. To this end, at least one further second electric conductor (9) is bonded onto the first electric conductor (8) by way of at least one second bond connection (10, 13), the two bond connections (10) being located offset from each other. The invention further relates to a method for producing an electrical bond connection arrangement, which exists between a first electrical contact surface and a second electrical contact surface.

IPC 8 full level

H01L 21/60 (2006.01); H01L 23/49 (2006.01)

CPC (source: EP US)

H01L 24/34 (2013.01 - US); H01L 24/37 (2013.01 - US); H01L 24/48 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 24/78 (2013.01 - EP US); H01L 24/85 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 2224/1147 (2013.01 - EP US); H01L 2224/37599 (2013.01 - US); H01L 2224/45014 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/48455 (2013.01 - EP US); H01L 2224/4846 (2013.01 - EP US); H01L 2224/48472 (2013.01 - EP US); H01L 2224/48699 (2013.01 - EP US); H01L 2224/49111 (2013.01 - EP US); H01L 2224/49174 (2013.01 - EP US); H01L 2224/49426 (2013.01 - EP US); H01L 2224/49427 (2013.01 - EP US); H01L 2224/78313 (2013.01 - EP US); H01L 2224/85203 (2013.01 - EP US); H01L 2224/85205 (2013.01 - EP US); H01L 2224/85207 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); Y10S 228/904 (2013.01 - EP US)

C-Set (source: EP US)

EP

  1. H01L 2224/45124 + H01L 2924/00014
  2. H01L 2224/48091 + H01L 2924/00014
  3. H01L 2224/49111 + H01L 2224/48472 + H01L 2924/00
  4. H01L 2224/49111 + H01L 2224/48247 + H01L 2924/00
  5. H01L 2224/45014 + H01L 2224/45124 + H01L 2924/00
  6. H01L 2224/48472 + H01L 2224/48247 + H01L 2924/00
  7. H01L 2224/85205 + H01L 2224/45124 + H01L 2924/00
  8. H01L 2224/4846 + H01L 2224/48472 + H01L 2924/00
  9. H01L 2224/48472 + H01L 2224/48091 + H01L 2924/00
  10. H01L 2924/00014 + H01L 2224/45099
  11. H01L 2224/85203 + H01L 2924/00
  12. H01L 2924/00014 + H01L 2224/37099
  13. H01L 2924/00014 + H01L 2224/85399
  14. H01L 2924/00014 + H01L 2224/05599
  15. H01L 2924/00014 + H01L 2224/45014 + H01L 2924/206

US

  1. H01L 2224/45124 + H01L 2924/00014
  2. H01L 2224/48091 + H01L 2924/00014
  3. H01L 2224/49111 + H01L 2224/48472 + H01L 2924/00
  4. H01L 2224/49111 + H01L 2224/48247 + H01L 2924/00
  5. H01L 2224/45014 + H01L 2224/45124 + H01L 2924/00
  6. H01L 2224/48472 + H01L 2224/48247 + H01L 2924/00
  7. H01L 2224/85205 + H01L 2224/45124 + H01L 2924/00
  8. H01L 2224/4846 + H01L 2224/48472 + H01L 2924/00
  9. H01L 2224/48472 + H01L 2224/48091 + H01L 2924/00
  10. H01L 2924/00014 + H01L 2224/45099
  11. H01L 2224/85203 + H01L 2924/00
  12. H01L 2924/00014 + H01L 2224/37099
  13. H01L 2224/37599 + H01L 2924/00014
  14. H01L 2924/00014 + H01L 2224/85399
  15. H01L 2924/00014 + H01L 2224/05599
  16. H01L 2924/00014 + H01L 2224/45014 + H01L 2924/206

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

DE 102008001671 A1 20091112; CN 102017112 A 20110413; CN 102017112 B 20130619; EP 2277196 A1 20110126; JP 2011520276 A 20110714; JP 5415525 B2 20140212; US 2011121059 A1 20110526; US 8181845 B2 20120522; WO 2009135737 A1 20091112

DOCDB simple family (application)

DE 102008001671 A 20080509; CN 200980116305 A 20090403; EP 09741955 A 20090403; EP 2009053987 W 20090403; JP 2011507857 A 20090403; US 73671109 A 20090403