EP 2277196 A1 20110126 - ELECTRICAL BOND CONNECTION ARRANGEMENT
Title (en)
ELECTRICAL BOND CONNECTION ARRANGEMENT
Title (de)
ELEKTRISCHE BONDVERBINDUNGSANORDNUNG
Title (fr)
AGENCEMENT ÉLECTRIQUE DE CONNEXION PAR LIAISON
Publication
Application
Priority
- EP 2009053987 W 20090403
- DE 102008001671 A 20080509
Abstract (en)
[origin: WO2009135737A1] The invention relates to an electrical bond connection arrangement between a first electrical contact surface and a second electrical contact surface, having at least one first electric conductor, which is bonded onto at least one of the contact surfaces by way of at least one first bond connection. To this end, at least one further second electric conductor (9) is bonded onto the first electric conductor (8) by way of at least one second bond connection (10, 13), the two bond connections (10) being located offset from each other. The invention further relates to a method for producing an electrical bond connection arrangement, which exists between a first electrical contact surface and a second electrical contact surface.
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/49 (2006.01)
CPC (source: EP US)
H01L 24/34 (2013.01 - US); H01L 24/37 (2013.01 - US); H01L 24/48 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 24/78 (2013.01 - EP US); H01L 24/85 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 2224/1147 (2013.01 - EP US); H01L 2224/37599 (2013.01 - US); H01L 2224/45014 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/48455 (2013.01 - EP US); H01L 2224/4846 (2013.01 - EP US); H01L 2224/48472 (2013.01 - EP US); H01L 2224/48699 (2013.01 - EP US); H01L 2224/49111 (2013.01 - EP US); H01L 2224/49174 (2013.01 - EP US); H01L 2224/49426 (2013.01 - EP US); H01L 2224/49427 (2013.01 - EP US); H01L 2224/78313 (2013.01 - EP US); H01L 2224/85203 (2013.01 - EP US); H01L 2224/85205 (2013.01 - EP US); H01L 2224/85207 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); Y10S 228/904 (2013.01 - EP US)
C-Set (source: EP US)
EP
- H01L 2224/45124 + H01L 2924/00014
- H01L 2224/48091 + H01L 2924/00014
- H01L 2224/49111 + H01L 2224/48472 + H01L 2924/00
- H01L 2224/49111 + H01L 2224/48247 + H01L 2924/00
- H01L 2224/45014 + H01L 2224/45124 + H01L 2924/00
- H01L 2224/48472 + H01L 2224/48247 + H01L 2924/00
- H01L 2224/85205 + H01L 2224/45124 + H01L 2924/00
- H01L 2224/4846 + H01L 2224/48472 + H01L 2924/00
- H01L 2224/48472 + H01L 2224/48091 + H01L 2924/00
- H01L 2924/00014 + H01L 2224/45099
- H01L 2224/85203 + H01L 2924/00
- H01L 2924/00014 + H01L 2224/37099
- H01L 2924/00014 + H01L 2224/85399
- H01L 2924/00014 + H01L 2224/05599
- H01L 2924/00014 + H01L 2224/45014 + H01L 2924/206
US
- H01L 2224/45124 + H01L 2924/00014
- H01L 2224/48091 + H01L 2924/00014
- H01L 2224/49111 + H01L 2224/48472 + H01L 2924/00
- H01L 2224/49111 + H01L 2224/48247 + H01L 2924/00
- H01L 2224/45014 + H01L 2224/45124 + H01L 2924/00
- H01L 2224/48472 + H01L 2224/48247 + H01L 2924/00
- H01L 2224/85205 + H01L 2224/45124 + H01L 2924/00
- H01L 2224/4846 + H01L 2224/48472 + H01L 2924/00
- H01L 2224/48472 + H01L 2224/48091 + H01L 2924/00
- H01L 2924/00014 + H01L 2224/45099
- H01L 2224/85203 + H01L 2924/00
- H01L 2924/00014 + H01L 2224/37099
- H01L 2224/37599 + H01L 2924/00014
- H01L 2924/00014 + H01L 2224/85399
- H01L 2924/00014 + H01L 2224/05599
- H01L 2924/00014 + H01L 2224/45014 + H01L 2924/206
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
DE 102008001671 A1 20091112; CN 102017112 A 20110413; CN 102017112 B 20130619; EP 2277196 A1 20110126; JP 2011520276 A 20110714; JP 5415525 B2 20140212; US 2011121059 A1 20110526; US 8181845 B2 20120522; WO 2009135737 A1 20091112
DOCDB simple family (application)
DE 102008001671 A 20080509; CN 200980116305 A 20090403; EP 09741955 A 20090403; EP 2009053987 W 20090403; JP 2011507857 A 20090403; US 73671109 A 20090403