EP 2280592 B1 20120502 - Construction of a contact area on a circuit board
Title (en)
Construction of a contact area on a circuit board
Title (de)
Ausbilden einer Kontaktfläche auf einer Leiterplatte
Title (fr)
Développement d'une surface de contact sur une plaque conductrice
Publication
Application
Priority
DE 102009027470 A 20090706
Abstract (en)
[origin: EP2280592A1] The method involves providing a printed circuit board (1) with a circuit layout (2). The circuit layout is attached to a ground connection (12) by an electrical connection (10). A structured mask layer is produced on the printed circuit board. An area is specified for the contact area on the printed circuit board. A conducting layer is formed from the gold.
IPC 8 full level
H05K 3/24 (2006.01)
CPC (source: EP)
H05K 3/242 (2013.01); H05K 3/243 (2013.01); H05K 2201/09781 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/107 (2013.01); H05K 2203/175 (2013.01)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2280592 A1 20110202; EP 2280592 B1 20120502; AT E556573 T1 20120515; DE 102009027470 A1 20110113
DOCDB simple family (application)
EP 10162085 A 20100506; AT 10162085 T 20100506; DE 102009027470 A 20090706