EP 2283715 A1 20110216 - CIRCUIT BOARD ARRANGEMENT FOR THERMALLY STRESSED ELECTRONIC COMPONENTS, IN PARTICULAR IN MOTOR VEHICLE CONTROL APPARATUS
Title (en)
CIRCUIT BOARD ARRANGEMENT FOR THERMALLY STRESSED ELECTRONIC COMPONENTS, IN PARTICULAR IN MOTOR VEHICLE CONTROL APPARATUS
Title (de)
LEITERPLATTENANORDNUNG FÜR THERMISCH BELASTETE ELEKTRONISCHE BAUELEMENTE, INSBESONDERE IN KRAFTFAHRZEUGSTEUERGERÄTEN
Title (fr)
AGENCEMENT DE CARTE À CIRCUITS IMPRIMÉS POUR COMPOSANTS ÉLECTRONIQUES SOLLICITÉS THERMIQUEMENT, EN PARTICULIER DANS DES APPAREILS DE COMMANDE DE VÉHICULES AUTOMOBILES
Publication
Application
Priority
- EP 2009056359 W 20090526
- DE 102008025078 A 20080526
- DE 102009022110 A 20090520
Abstract (en)
[origin: WO2009144215A1] Circuit board arrangement, in particular multiple layer circuit board arrangement (16) with at least one low-power circuit path, wherein the circuit board arrangement is suitable for population with at least one electronic circuit board element to be cooled, wherein the circuit board consisting of a nonconductive material comprises at least one cooling inlay (22, 21, 22') embedded in the circuit board for cooling of the power component, wherein the cooling inlay forms at least in part, a high power guide element for the at least one electronic power component, wherein the line cross section or the power carry capacity of the high power guide element is significantly greater than the line cross section or the current carry capacity of the low power circuit path, and wherein the high power guide element is used and/or is also used for electrical contacting of the power component.
IPC 8 full level
H05K 1/02 (2006.01)
CPC (source: EP US)
H05K 1/0204 (2013.01 - EP US); H05K 1/0263 (2013.01 - EP US); H05K 2201/10416 (2013.01 - EP US); Y10T 29/4913 (2015.01 - EP US)
Citation (search report)
See references of WO 2009144215A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
WO 2009144215 A1 20091203; DE 102009022110 A1 20100204; EP 2283715 A1 20110216; US 2011096495 A1 20110428
DOCDB simple family (application)
EP 2009056359 W 20090526; DE 102009022110 A 20090520; EP 09753870 A 20090526; US 99428609 A 20090526