EP 2289100 A2 20110302 - METHOD FOR THE MANUFACTURE OF AN ELECTRONIC ASSEMBLY
Title (en)
METHOD FOR THE MANUFACTURE OF AN ELECTRONIC ASSEMBLY
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN BAUGRUPPE
Title (fr)
PROCÉDÉ DE FABRICATION D'UN MODULE ÉLECTRONIQUE
Publication
Application
Priority
- EP 2009056286 W 20090525
- DE 102008002532 A 20080619
Abstract (en)
[origin: WO2009153129A2] The invention relates to a method for the manufacture of an electronic assembly, comprising at least one electronic component (9) and also a conductor track structure (7) which is used to make contact with the at least one electronic component (9). The method involves a first step being used to pattern a conductive foil (1) to produce the conductor track structure (7). In a second step, the conductor track structure (7) has the at least one electronic component (9) fitted. In a final step, a further foil is laminated onto the conductive foil (1) fitted with the at least one electronic component (9) on the side on which the conductive foil (1) has the at least one electronic component (9) fitted.
IPC 8 full level
H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/60 (2006.01)
CPC (source: EP US)
H01L 21/4825 (2013.01 - EP US); H01L 23/5387 (2013.01 - EP US); H01L 23/5389 (2013.01 - EP US); H01L 24/18 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 24/96 (2013.01 - EP); H05K 1/186 (2013.01 - EP US); H01L 2221/68377 (2013.01 - EP US); H01L 2224/05568 (2013.01 - EP US); H01L 2224/05573 (2013.01 - EP US); H01L 2224/16237 (2013.01 - EP US); H01L 2224/18 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H05K 1/0284 (2013.01 - EP US); H05K 1/189 (2013.01 - EP US); H05K 3/0014 (2013.01 - EP US); H05K 3/4038 (2013.01 - EP US); H05K 2201/0305 (2013.01 - EP US); H05K 2201/0355 (2013.01 - EP US); H05K 2201/10674 (2013.01 - EP US); H05K 2203/302 (2013.01 - EP US); Y10T 29/49126 (2015.01 - EP US); Y10T 29/4913 (2015.01 - EP US); Y10T 29/49165 (2015.01 - EP US)
Citation (search report)
See references of WO 2009153129A2
Citation (examination)
- US 2007099449 A1 20070503 - SUZUKI DAIGO [JP], et al
- US 2005006142 A1 20050113 - ISHIMARU YUKIHIRO [JP], et al
- US 2003137045 A1 20030724 - SUGAYA YASUHIRO [JP], et al
- US 2005218491 A1 20051006 - SASAKI YORIHIKO [JP], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
DE 102008002532 A1 20091224; CN 102124560 A 20110713; CN 102124560 B 20140507; EP 2289100 A2 20110302; JP 2011524645 A 20110901; US 2011138620 A1 20110616; US 8505198 B2 20130813; WO 2009153129 A2 20091223; WO 2009153129 A3 20100304
DOCDB simple family (application)
DE 102008002532 A 20080619; CN 200980132214 A 20090525; EP 09765709 A 20090525; EP 2009056286 W 20090525; JP 2011513971 A 20090525; US 99983409 A 20090525