EP 2289668 A2 20110302 - Polishing apparatus
Title (en)
Polishing apparatus
Title (de)
Poliervorrichtung
Title (fr)
Appareil de polissage
Publication
Application
Priority
JP 2009200690 A 20090831
Abstract (en)
The polishing apparatus (10) is capable of improving accuracy of polishing a work (W). The work (W) is pressed onto a polishing cloth (11), with an elastic sheet (36), by a pressing force generated by second pressing means (34) and applied to a carrier (28) and inner pressure of a first fluid chamber (38) generated by a fluid supplied thereto, so as to polish the work (W). The fluid, which has been downwardly supplied into the first fluid chamber (38), horizontally flows outward in the first fluid chamber (38), collides with a side wall of a concave part (23) of a board-shaped member (22) and flows upward, and then the fluid is discharged outside from a fluid outlet (44), thereby a fluid feeding member (31) follows movement of the elastic sheet (36) and maintains parallel thereto, and the fluid feeding member (31) is centered in the first fluid chamber (38).
IPC 8 full level
B24B 37/30 (2012.01); H01L 21/304 (2006.01)
CPC (source: EP US)
B24B 37/30 (2013.01 - EP US)
Citation (applicant)
JP 2000317819 A 20001121 - TOKYO SEIMITSU CO LTD
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
Designated extension state (EPC)
BA ME RS
DOCDB simple family (publication)
EP 2289668 A2 20110302; EP 2289668 A3 20140122; EP 2289668 B1 20190206; CN 102001036 A 20110406; CN 102001036 B 20140924; JP 2011051047 A 20110317; JP 5392483 B2 20140122; KR 101696932 B1 20170201; KR 20110023785 A 20110308; US 2011053474 A1 20110303
DOCDB simple family (application)
EP 10251498 A 20100826; CN 201010268504 A 20100830; JP 2009200690 A 20090831; KR 20100082834 A 20100826; US 86098110 A 20100823