Global Patent Index - EP 2291061 A3

EP 2291061 A3 20111116 - Composite material, high frequency circuit substrate made therefrom and making method thereof

Title (en)

Composite material, high frequency circuit substrate made therefrom and making method thereof

Title (de)

Verbundmaterial, daraus hergestelltes Hochfrequenz-Leitungssubstrat und Herstellungsverfahren dafür

Title (fr)

Matériau composite, substrat de circuit haute fréquence fabriqué à partir de celui-ci et son procédé de fabrication

Publication

EP 2291061 A3 20111116 (EN)

Application

EP 10152475 A 20100203

Priority

CN 200910189729 A 20090824

Abstract (en)

[origin: EP2291061A2] The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present invention enable to readily make prepregs. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and good heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making circuit substrates of high-frequency electronic equipments.

IPC 8 full level

C08J 5/24 (2006.01); C08L 9/06 (2006.01); C08L 25/18 (2006.01); H05K 1/03 (2006.01)

CPC (source: EP US)

C08F 212/08 (2013.01 - EP US); C08F 212/22 (2020.02 - EP US); C08F 212/34 (2013.01 - EP US); C08J 5/244 (2021.05 - EP US); C08J 5/249 (2021.05 - EP US); C08L 9/06 (2013.01 - EP US); C08L 25/18 (2013.01 - EP US); H05K 1/032 (2013.01 - EP US); C08J 2309/00 (2013.01 - EP US); C08J 2309/06 (2013.01 - EP US); C08J 2325/18 (2013.01 - EP US); C08J 2353/02 (2013.01 - EP US); C08K 3/013 (2017.12 - EP US); C08K 3/40 (2013.01 - EP US); C08K 5/0066 (2013.01 - EP US); C08K 5/14 (2013.01 - EP US); C08K 7/14 (2013.01 - EP US); H05K 1/0366 (2013.01 - EP US); H05K 1/0373 (2013.01 - EP US); H05K 2201/012 (2013.01 - EP US); H05K 2201/0158 (2013.01 - EP US); H05K 2201/0209 (2013.01 - EP US); Y10T 428/31533 (2015.04 - EP US); Y10T 428/31544 (2015.04 - EP US); Y10T 428/31547 (2015.04 - EP US); Y10T 428/31645 (2015.04 - EP US); Y10T 442/2992 (2015.04 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

EP 2291061 A2 20110302; EP 2291061 A3 20111116; EP 2291061 B1 20140507; AU 2010200472 A1 20110310; AU 2010200472 B2 20111103; CN 101643565 A 20100210; CN 101643565 B 20100721; US 2011045304 A1 20110224; US 8883316 B2 20141111

DOCDB simple family (application)

EP 10152475 A 20100203; AU 2010200472 A 20100210; CN 200910189729 A 20090824; US 69494810 A 20100127