EP 2291260 B1 20180404 - PROCESS CHAMBER FOR SELECTIVE LASER SINTERING AND USE THEREOF FOR MAKING A PIECE
Title (en)
PROCESS CHAMBER FOR SELECTIVE LASER SINTERING AND USE THEREOF FOR MAKING A PIECE
Title (de)
PROZESSKAMMER FÜR DAS SELEKTIVE LASERSCHMELZEN UND DEREN VERWENDUNG ZUM ERZEUGEN EINES BAUTEILS
Title (fr)
ENCEINTE POUR LE FRITTAGE SÉLECTIF AU LASER ET UTILISATION ASSOCIÉE POUR PRODUIRE UNE PIÈCE
Publication
Application
Priority
- EP 2009057514 W 20090617
- DE 102008030186 A 20080626
Abstract (en)
[origin: WO2009156316A1] The invention relates to a method for producing a component through selective laser melting and to a process chamber (11) for carrying out the method. According to the invention, the selective laser melting by way of a laser (17) is also used for producing coating areas (25) of the component (14) being produced, said coating areas having a composition that differs from the composition of the powder (16). This is accomplished by intermittently introducing a reactive gas (27) that reacts with the powder material or that produces a material on the component (14) from precursors present in the reactive gas. In the process chamber according to the invention, an additional feed line (28a, 28b) is provided for introducing reactive gas, said feed line permitting the feeding of the reactive gas if possible close to the laser (17).
IPC 8 full level
B23K 26/34 (2014.01); B22F 3/105 (2006.01)
CPC (source: EP US)
B22F 10/28 (2021.01 - EP US); B22F 10/32 (2021.01 - EP US); B22F 10/50 (2021.01 - EP US); B22F 12/70 (2021.01 - EP US); B23K 26/32 (2013.01 - EP US); B23K 26/34 (2013.01 - EP US); B23K 35/0244 (2013.01 - EP US); B23K 35/38 (2013.01 - EP US); B23K 35/383 (2013.01 - EP US); B22F 2998/00 (2013.01 - EP US); B23K 2103/14 (2018.07 - EP US); Y02P 10/25 (2015.11 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102008030186 A1 20091231; CN 102076456 A 20110525; EP 2291260 A1 20110309; EP 2291260 B1 20180404; JP 2011525428 A 20110922; JP 5611198 B2 20141022; US 2011135840 A1 20110609; WO 2009156316 A1 20091230
DOCDB simple family (application)
DE 102008030186 A 20080626; CN 200980124561 A 20090617; EP 09769165 A 20090617; EP 2009057514 W 20090617; JP 2011515315 A 20090617; US 73727509 A 20090617