EP 2295355 B1 20140618 - Method, device and adhesive tape for splicing label tapes and spliceable label tape
Title (en)
Method, device and adhesive tape for splicing label tapes and spliceable label tape
Title (de)
Verfahren, Vorrichtung und Klebeband zum Spleißen von Etikettenbändern sowie spleißbares Etikettenband
Title (fr)
Procédé, dispositif et bande adhésive pour l'épissage de bandes d'étiquettes et bande d'étiquettes pouvant être épissées
Publication
Application
Priority
DE 102009041017 A 20090910
Abstract (en)
[origin: EP2295355A2] The method involves holding a subsequent label strip (3) in a supplying position (B), and combining the subsequent label strip and a front label strip (2) for producing a spliced connection. The subsequent label strip is held by influencing a magnetic field. The magnetic field is produced by a permanent magnet (7). Independent claims are also included for the following: (1) a device for splicing label strips; (2) a label strip comprises a magnetic end section; and (3) an adhesive tape for splicing label strips.
IPC 8 full level
B65H 19/18 (2006.01)
CPC (source: EP)
B65H 19/1831 (2013.01); B65H 2301/44332 (2013.01); B65H 2301/46172 (2013.01); B65H 2301/4621 (2013.01); B65H 2301/46412 (2013.01); B65H 2701/1714 (2013.01); B65H 2701/192 (2013.01)
Citation (examination)
EP 0446901 A2 19910918 - HITACHI LTD [JP]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2295355 A2 20110316; EP 2295355 A3 20110928; EP 2295355 B1 20140618; CN 102020042 A 20110420; CN 102020042 B 20131120; DE 102009041017 A1 20110324
DOCDB simple family (application)
EP 10171750 A 20100803; CN 201010273158 A 20100902; DE 102009041017 A 20090910