EP 2300195 A2 20110330 - GOLD-TIN-INDIUM SOLDER FOR PROCESSING COMPATIBILITY WITH LEAD-FREE TIN-BASED SOLDER
Title (en)
GOLD-TIN-INDIUM SOLDER FOR PROCESSING COMPATIBILITY WITH LEAD-FREE TIN-BASED SOLDER
Title (de)
GOLD-ZINN-INDIUM-LOT FÜR BEARBEITUNGSKOMPATIBILITÄT MIT EINEM BLEIFREIEN LOT AUF ZINNBASIS
Title (fr)
BRASURE OR-ÉTAIN-INDIUM POUR LA COMPATIBILITÉ DE TRAITEMENT AVEC UNE BRASURE À BASE D ÉTAIN SANS PLOMB
Publication
Application
Priority
- US 2009047748 W 20090618
- US 7477108 P 20080623
Abstract (en)
[origin: WO2010008752A2] Disclosed in this specification is a lead-free soldering alloy made of gold, tin and indium. The tin is present in a concentration of 17.5% to 20.5%, the indium is present in a concentration of 2.0% to 6.0% and the balance is gold and the alloy has a melting point between 290 0C and 340 0C and preferably between 300 0C and 340 0C. The soldering alloy is particularly useful for hermetically sealing semiconductor devices since the melting temperature is sufficiently high to permit post-seal heating and sufficiently low to allow sealing of the semiconductor without causing damage.
IPC 8 full level
B23K 35/30 (2006.01); B23K 35/22 (2006.01); B23K 35/26 (2006.01); C22C 5/02 (2006.01); H01L 21/60 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 23/28 (2006.01)
CPC (source: EP US)
B23K 35/3013 (2013.01 - EP US); C22C 5/02 (2013.01 - EP US); H01L 23/10 (2013.01 - EP US); B23K 2101/36 (2018.08 - EP US); H01L 2924/0002 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/166 (2013.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
WO 2010008752 A2 20100121; WO 2010008752 A3 20100325; CN 102066045 A 20110518; CN 102066045 B 20130710; EP 2300195 A2 20110330; EP 2300195 A4 20120718; EP 2300195 B1 20200122; JP 2011526838 A 20111020; KR 20110036541 A 20110407; MY 155656 A 20151113; TW 201008693 A 20100301; TW I466752 B 20150101; US 2011180929 A1 20110728; US 8294271 B2 20121023
DOCDB simple family (application)
US 2009047748 W 20090618; CN 200980123550 A 20090618; EP 09798430 A 20090618; JP 2011516462 A 20090618; KR 20107028809 A 20090618; MY PI20105988 A 20090618; TW 98120510 A 20090618; US 99682509 A 20090618