Global Patent Index - EP 2301762 B1

EP 2301762 B1 20130925 - Method and a device for applying a structure to a composite wood board

Title (en)

Method and a device for applying a structure to a composite wood board

Title (de)

Verfahren und eine Vorrichtung zum Aufbringen einer Struktur auf eine Holzwerkstoffplatte

Title (fr)

Procédé et un dispositif d'application d'une structure sur une plaque en matériau dérivé du bois

Publication

EP 2301762 B1 20130925 (DE)

Application

EP 10156186 A 20100311

Priority

EP 10156186 A 20100311

Abstract (en)

[origin: EP2301762A1] The method involves applying a set of decorative materials by a digital printer (14), and applying a lacquer coating. A lacquer processing unit to be influenced is applied, and a final coating is processed, such that the application of the lacquer processing unit is enabled by the digital printer. The lacquer processing unit and unit for applying the decorative material and the lacquer coating are controlled by a controlling unit. A composite wood board (1) is provided with a layer or non-layer upper surface (15) with a decorative synchronous structure. An independent claim is also included for a device for applying a structure to a composite wood board, comprising a decorative material applying unit.

IPC 8 full level

B44C 5/04 (2006.01); E04F 13/00 (2006.01); E04F 15/00 (2006.01)

CPC (source: EP)

B44C 3/044 (2013.01); B44C 5/043 (2013.01); E04F 13/08 (2013.01); E04F 15/02 (2013.01); B41M 5/0047 (2013.01); B41M 5/0076 (2013.01)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

EP 2301762 A1 20110330; EP 2301762 B1 20130925; EP 2301762 B9 20131225; PL 2301762 T3 20140331

DOCDB simple family (application)

EP 10156186 A 20100311; PL 10156186 T 20100311