Global Patent Index - EP 2303956 A1

EP 2303956 A1 20110406 - COMPOSITE COMPRISING NANOSIZE POWDER AND USE OF THE COMPOSITE

Title (en)

COMPOSITE COMPRISING NANOSIZE POWDER AND USE OF THE COMPOSITE

Title (de)

VERBUNDMATERIAL MIT NANO-PULVER UND VERWENDUNG DES VERBUNDMATERIALS

Title (fr)

MATÉRIAU COMPOSITE AVEC NANOPOUDRE ET UTILISATION DU MATÉRIAU COMPOSITE

Publication

EP 2303956 A1 20110406 (DE)

Application

EP 09772249 A 20090529

Priority

  • EP 2009056612 W 20090529
  • DE 102008030904 A 20080630

Abstract (en)

[origin: WO2010000549A1] The invention relates to a composite comprising at least one base material and at least one filler powder mixture dispersed in the base material, where the filler powder mixture comprises a filler powder fraction and at least one further filler powder fraction, the filler powder fraction has an average powder particle diameter (D50) selected from the range from 1 µm to 100 µm and the total proportion of the filler powder mixture in the composite (degree of fill) is above 50% by weight. The composite is characterized in that the further filler powder fraction has a further average powder particle diameter selected from the range from 1 nm to 50 nm and the proportion of the further filler powder fraction in the filler powder mixture is selected from the range from 0.1% by weight to 50% by weight. It has been found that a high degree of fill can be achieved at a low viscosity in the presence of nanosize filler particles. The composite is particularly suitable as embedding composition (pourable resin system).

IPC 8 full level

C08K 3/00 (2006.01)

CPC (source: EP US)

B82Y 30/00 (2013.01 - EP US); C08K 3/01 (2017.12 - EP US); C08K 2201/011 (2013.01 - EP US); C08K 2201/014 (2013.01 - EP US)

Citation (search report)

See references of WO 2010000549A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

DE 102008030904 A1 20091231; CN 102076749 A 20110525; EP 2303956 A1 20110406; US 2011098383 A1 20110428; WO 2010000549 A1 20100107

DOCDB simple family (application)

DE 102008030904 A 20080630; CN 200980125221 A 20090529; EP 09772249 A 20090529; EP 2009056612 W 20090529; US 73733609 A 20090529