EP 2308275 A1 20110413 - METHOD FOR THE HOT STAMPING OF AT LEAST ONE CONDUCTOR TRACK ONTO A SUBSTRATE, SUBSTRATE COMPRISING AT LEAST ONE CONDUCTOR TRACK AND STAMPING TOOL
Title (en)
METHOD FOR THE HOT STAMPING OF AT LEAST ONE CONDUCTOR TRACK ONTO A SUBSTRATE, SUBSTRATE COMPRISING AT LEAST ONE CONDUCTOR TRACK AND STAMPING TOOL
Title (de)
VERFAHREN ZUM HEISSPRÄGEN MINDESTENS EINER LEITERBAHN AUF EIN SUBSTRAT, SUBSTRAT MIT MINDESTENS EINER LEITERBAHN SOWIE PRÄGESTEMPEL
Title (fr)
PROCÉDÉ D'ESTAMPAGE À CHAUD D'AU MOINS UNE PISTE CONDUCTRICE SUR UN SUBSTRAT, SUBSTRAT POURVU D'AU MOINS UNE PISTE CONDUCTRICE ET POINÇON D'ESTAMPAGE
Publication
Application
Priority
- EP 2009057376 W 20090615
- DE 102008040882 A 20080731
Abstract (en)
[origin: WO2010012540A1] The invention relates to a method for the hot stamping of at least one conductor track (17) onto a substrate (1), wherein a film (3) having at least one electrically conductive layer (4) is pressed against the substrate (1) in a stamping direction (16) by means of a stamping tool (7) having a structured stamping surface (8). The invention provides for the film (3) to be stamped in such a way that the conductor track (17) acquires three-dimensional shaping. Furthermore, the invention relates to a substrate (1) and also a stamping tool (7).
IPC 8 full level
H05K 3/04 (2006.01)
CPC (source: EP)
H05K 3/041 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/091 (2013.01); H05K 2203/0108 (2013.01)
Citation (search report)
See references of WO 2010012540A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
DE 102008040882 A1 20100204; CN 102165853 A 20110824; CN 102165853 B 20170524; EP 2308275 A1 20110413; WO 2010012540 A1 20100204; WO 2010012540 A9 20110310
DOCDB simple family (application)
DE 102008040882 A 20080731; CN 200980129698 A 20090615; EP 09779754 A 20090615; EP 2009057376 W 20090615