EP 2312021 B1 20200318 - METHOD FOR OBTAINING A DEPOSIT OF A YELLOW GOLD ALLOY BY GALVANOPLASTY WITHOUT USING TOXIC METALS
Title (en)
METHOD FOR OBTAINING A DEPOSIT OF A YELLOW GOLD ALLOY BY GALVANOPLASTY WITHOUT USING TOXIC METALS
Title (de)
VERFAHREN ZUM ERHALTEN EINER GELBEN GOLDLEGIERUNGSABLAGERUNG DURCH GALVANOPLASTIK OHNE VERWENDUNG VON GIFTIGEN METALLEN
Title (fr)
PROCÉDÉ D'OBTENTION D'UN DÉPÔT D'ALLIAGE D'OR JAUNE PAR GALVANOPLASTIE SANS UTILISATION DE MÉTAUX TOXIQUES
Publication
Application
Priority
EP 09173198 A 20091015
Abstract (en)
[origin: EP2312021A1] Galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including gold metal in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, where the alloy metal is copper, which is in double copper and potassium cyanide form, and silver, or in cyanide form, comprises depositing a mirror-bright yellow gold alloy on the electrode, where the bath respects a proportion of 9.08% gold, 90.85% copper and 0.07% silver containing neither cadmium nor zinc. Independent claims are also included for: (1) an electrolytic deposition in the form of a gold alloy obtained from the above method having a thickness of 1-800 mu and comprising copper and silver as the third main compound, allowing a bright 3N color to be obtained; and (2) an electrolytic deposition is in the form of a gold, copper, and silver alloy, where the deposition is made of gold (75%), copper (21%) and silver (4%), allowing a bright 3N color to be obtained.
IPC 8 full level
C25D 3/62 (2006.01)
CPC (source: EP US)
C25D 3/62 (2013.01 - EP US); B05D 1/18 (2013.01 - US); C25D 3/56 (2013.01 - US); C25D 3/58 (2013.01 - US); C25D 7/005 (2013.01 - US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2312021 A1 20110420; EP 2312021 B1 20200318; CN 102041527 A 20110504; CN 102041527 B 20140917; HK 1157415 A1 20120629; JP 2011084815 A 20110428; JP 5563421 B2 20140730; KR 101297476 B1 20130816; KR 20110041424 A 20110421; US 2011089040 A1 20110421; US 2015027898 A1 20150129; US 2018171499 A1 20180621; US 2020240030 A1 20200730; US 9567684 B2 20170214
DOCDB simple family (application)
EP 09173198 A 20091015; CN 201010552012 A 20101015; HK 11111618 A 20111027; JP 2010232903 A 20101015; KR 20100100585 A 20101015; US 201414452364 A 20140805; US 201815898330 A 20180216; US 202016847699 A 20200414; US 90578810 A 20101015