EP 2313338 A2 20110427 - PROCESS FOR MANUFACTURING A COMPONENT, PROCESS FOR MANUFACTURING A COMPONENT ARRANGEMENT, COMPONENT AND COMPONENT ARRANGEMENT
Title (en)
PROCESS FOR MANUFACTURING A COMPONENT, PROCESS FOR MANUFACTURING A COMPONENT ARRANGEMENT, COMPONENT AND COMPONENT ARRANGEMENT
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES BAUELEMENTS, VERFAHREN ZUR HERSTELLUNG EINER BAUELEMENTANORDNUNG, BAUELEMENT UND BAUELEMENTANORDNUNG
Title (fr)
PROCÉDÉ DE RÉALISATION D'UN COMPOSANT, PROCÉDÉ DE RÉALISATION D'UN SYSTÈME DE COMPOSANTS, COMPOSANT ET SYSTÈME DE COMPOSANTS CORRESPONDANTS
Publication
Application
Priority
- EP 2009057106 W 20090609
- DE 102008040521 A 20080718
Abstract (en)
[origin: WO2010006849A2] The invention proposes a process for manufacturing a component, wherein, in a first manufacturing step, a basic structure having a substrate, a membrane and a cavern region is provided, wherein the membrane is arranged substantially parallel to a plane of principal extent of the substrate, wherein the cavern region is arranged between the substrate and the membrane, wherein the cavern region has an access opening and wherein, in a second manufacturing step, a first conductive layer is arranged at least partially in the cavern region and, in particular, on a second side of the membrane which faces towards the substrate perpendicularly to the plane of principal extent.
IPC 8 full level
B81C 1/00 (2006.01)
CPC (source: EP US)
B81B 7/0006 (2013.01 - EP US); B81C 99/008 (2013.01 - EP US); B81B 2207/093 (2013.01 - EP US)
Citation (search report)
See references of WO 2010006849A2
Citation (examination)
- US 2003222335 A1 20031204 - HIRANO KOICHI [JP], et al
- US 2006273430 A1 20061207 - HUA YAPING [CN], et al
- US 2005084998 A1 20050421 - HORNING ROBERT D [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
DE 102008040521 A1 20100121; CN 102099281 A 20110615; CN 102099281 B 20150708; EP 2313338 A2 20110427; TW 201016594 A 20100501; TW I534068 B 20160521; US 2011169107 A1 20110714; WO 2010006849 A2 20100121; WO 2010006849 A3 20101229
DOCDB simple family (application)
DE 102008040521 A 20080718; CN 200980128186 A 20090609; EP 09779687 A 20090609; EP 2009057106 W 20090609; TW 98124030 A 20090716; US 200913054435 A 20090609