Global Patent Index - EP 2316614 B1

EP 2316614 B1 20190717 - POLISHING PAD AND METHOD FOR MANUFACTURING THE POLISHING PAD

Title (en)

POLISHING PAD AND METHOD FOR MANUFACTURING THE POLISHING PAD

Title (de)

POLIERKISSEN UND VERFAHREN ZUR HERSTELLUNG DES POLIERKISSENS

Title (fr)

TAMPON DE POLISSAGE ET PROCÉDÉ DE FABRICATION DU TAMPON DE POLISSAGE

Publication

EP 2316614 B1 20190717 (EN)

Application

EP 09804969 A 20090804

Priority

  • JP 2009063802 W 20090804
  • JP 2008205981 A 20080808

Abstract (en)

[origin: EP2316614A1] A polishing pad is disclosed which is less likely to cause scratches, and has an excellent planarization performance and polishing stability. In one aspect, the invention provides a polishing pad comprising an ultrafine fiber-entangled body formed of ultrafine fibers having an average fineness of 0.01 to 0.8 dtex, and a polymeric elastomer. The polymeric elastomer has a glass transition temperature of-10°C or below, storage moduli at 23°C and 50°C of 90 to 900 MPa, and a water absorption ratio, when saturated with water at 50°C, of 0.2 to 5 mass%.

IPC 8 full level

B24B 37/00 (2012.01); B24B 37/24 (2012.01); D04H 3/016 (2012.01); D04H 3/10 (2012.01); D04H 3/14 (2012.01); H01L 21/304 (2006.01)

CPC (source: EP KR US)

B24B 37/24 (2013.01 - EP KR US); D04H 3/016 (2013.01 - EP KR US); D04H 3/10 (2013.01 - EP KR US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

EP 2316614 A1 20110504; EP 2316614 A4 20140820; EP 2316614 B1 20190717; CN 102119069 A 20110706; CN 102119069 B 20150415; HK 1154828 A1 20120504; IL 211092 A0 20110428; IL 211092 A 20140331; JP 5411862 B2 20140212; JP WO2010016486 A1 20120126; KR 101410116 B1 20140625; KR 20110042213 A 20110425; TW 201016393 A 20100501; TW I460052 B 20141111; US 2011171890 A1 20110714; US 2019218697 A1 20190718; WO 2010016486 A1 20100211

DOCDB simple family (application)

EP 09804969 A 20090804; CN 200980131008 A 20090804; HK 11108960 A 20110824; IL 21109211 A 20110206; JP 2009063802 W 20090804; JP 2010523862 A 20090804; KR 20117005315 A 20090804; TW 98126513 A 20090806; US 200913058016 A 20090804; US 201916368190 A 20190328