EP 2318885 A1 20110511 - PROCESS FOR REALISING A RESIST COATING IN A RECESS ON THE SURFACE OF A SUBSTRATE, IN PARTICULAR A WAFER
Title (en)
PROCESS FOR REALISING A RESIST COATING IN A RECESS ON THE SURFACE OF A SUBSTRATE, IN PARTICULAR A WAFER
Title (de)
VERFAHREN ZUR RESIST-BESCHICHTUNG EINER VERTIEFUNG IN DER OBERFLÄCHE EINES SUBSTRATS, INSBESONDERE EINES WAFERS
Title (fr)
PROCÉDÉ POUR DÉPOSER UN RÉSISTE DANS DES CREUX À LA SURFACE D'UN SUBSTRAT, EN PARTICULEIR D'UN WAFER
Publication
Application
Priority
- EP 2009060789 W 20090820
- DE 102008045068 A 20080829
Abstract (en)
[origin: WO2010023156A1] The invention provides a method for resist coating a recess in the surface of a substrate, in particular a wafer. This involves filling the recess with a resist solution and heating the substrate, so that the solvent of the resist solution evaporates and the bottom of the recess and at least portions of the inner walls of the recess that adjoin the bottom are coated with the resist.
IPC 8 full level
G03F 7/16 (2006.01)
CPC (source: EP)
G03F 7/168 (2013.01); H01L 21/76898 (2013.01); G03F 7/095 (2013.01)
Citation (search report)
See references of WO 2010023156A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
DE 102008045068 A1 20100304; EP 2318885 A1 20110511; EP 3112935 A1 20170104; EP 3112935 B1 20210505; TW 201027264 A 20100716; TW I494701 B 20150801; WO 2010023156 A1 20100304
DOCDB simple family (application)
DE 102008045068 A 20080829; EP 09782047 A 20090820; EP 16170660 A 20090820; EP 2009060789 W 20090820; TW 98128856 A 20090827