Global Patent Index - EP 2319945 A2

EP 2319945 A2 20110511 - Integrated metal processing facility

Title (en)

Integrated metal processing facility

Title (de)

Integrierte Metallbehandlungsanlage

Title (fr)

Installation de traitement de métal intégrée

Publication

EP 2319945 A2 20110511 (EN)

Application

EP 10197136 A 20050601

Previously filed application

19161 20050601 US

Priority

  • EP 05756565 A 20050601
  • US 57610704 P 20040602

Abstract (en)

A integrated facility for forming and heat treating a metal casting is provided, the facility comprising: a pouring station for pouring a molten metal into a mold to form a casting; a process temperature control station downstream from said pouring station, said process temperature control station comprising a temperature sensing device in a heat treatment furnace; wherein said the temperature sensing device and said heat source are adapted to maintain the temperature of the casting at or above a process control temperature for the metal of the casting, and wherein upon receipt of a rejection signal from said temperature sensing device, said transfer mechanism removes the casting prior to entry into said furnace.

IPC 8 full level

C21D 11/00 (2006.01); B22D 46/00 (2006.01); C21D 9/00 (2006.01); C22F 1/00 (2006.01); F27B 9/02 (2006.01); F27B 9/20 (2006.01); F27B 9/40 (2006.01); F27D 19/00 (2006.01); F27D 21/00 (2006.01); C21D 1/84 (2006.01)

CPC (source: EP KR)

B22D 46/00 (2013.01 - KR); C21D 6/00 (2013.01 - KR); C21D 9/0068 (2013.01 - EP KR); C21D 11/00 (2013.01 - EP KR); C21D 11/005 (2013.01 - EP); C22F 1/00 (2013.01 - EP KR); F27B 9/20 (2013.01 - EP); F27B 9/40 (2013.01 - EP); F27D 19/00 (2013.01 - EP); F27D 21/0014 (2013.01 - EP); C21D 1/84 (2013.01 - EP)

Citation (applicant)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2005121386 A2 20051222; WO 2005121386 A3 20060316; CN 101001963 A 20070718; CN 101001963 B 20150819; CN 102000813 A 20110406; CN 102000813 B 20120725; EP 1766100 A2 20070328; EP 1766100 B1 20120808; EP 2319945 A2 20110511; EP 2319945 A3 20111116; EP 2319945 B1 20130313; JP 2008501860 A 20080124; JP 2012040614 A 20120301; JP 2014073531 A 20140424; JP 5575365 B2 20140820; JP 5689403 B2 20150325; KR 20070024675 A 20070302; MX PA06014028 A 20070814

DOCDB simple family (application)

US 2005019161 W 20050601; CN 200580024668 A 20050601; CN 201010500655 A 20050601; EP 05756565 A 20050601; EP 10197136 A 20050601; JP 2007515509 A 20050601; JP 2011256203 A 20111124; JP 2014012679 A 20140127; KR 20067027792 A 20061229; MX PA06014028 A 20050601