EP 2319947 A4 20111123 - COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS, AND MANUFACTURING METHOD THEREFOR
Title (en)
COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS, AND MANUFACTURING METHOD THEREFOR
Title (de)
KUPFERLEGIERUNGSMATERIAL FÜR ELEKTRISCHE UND ELEKTRONISCHE BAUTEILE SOWIE HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
MATERIAU EN ALLIAGE DE CUIVRE POUR COMPOSANTS ELECTRIQUES ET ELECTRONIQUES ET PROCEDE DE FABRICATION ASSOCIE
Publication
Application
Priority
- JP 2009063616 W 20090730
- JP 2008197672 A 20080731
- JP 2008197677 A 20080731
- JP 2008202468 A 20080805
Abstract (en)
[origin: EP2319947A1] A copper alloy material for an electric/electronic part, having a composition comprising Co 0.5 to 2.0 mass% and Si 0.1 to 0.5 mass%, with the balance of Cu and inevitable impurities, in which a copper alloy of a matrix has a grain size of 3 to 35 µm, a precipitate composed of Co and Si has a particle size of 5 to 50 nm, the precipitate has a density of 1×10 8 to 1×10 10 number/mm 2 , and the copper alloy material has a tensile strength of 550 MPa and an electrical conductivity of 50 %IACS or more.
IPC 8 full level
C22C 9/06 (2006.01); C22C 9/00 (2006.01); C22C 9/02 (2006.01); C22C 9/04 (2006.01); C22C 9/05 (2006.01); C22C 9/10 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01); H01B 1/02 (2006.01); H01B 13/00 (2006.01)
CPC (source: EP US)
C22C 9/06 (2013.01 - EP US); C22C 9/10 (2013.01 - EP US); C22F 1/00 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US); H01B 1/023 (2013.01 - EP US)
Citation (search report)
- [I] US 2008056930 A1 20080306 - ITO TAKEFUMI [JP], et al
- [E] EP 2248921 A1 20101110 - FURUKAWA ELECTRIC CO LTD [JP]
- See references of WO 2010013790A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2319947 A1 20110511; EP 2319947 A4 20111123; CN 102112639 A 20110629; JP 5224415 B2 20130703; JP WO2010013790 A1 20120112; KR 101570555 B1 20151119; KR 20110038143 A 20110413; US 2011186192 A1 20110804; WO 2010013790 A1 20100204
DOCDB simple family (application)
EP 09803032 A 20090730; CN 200980130311 A 20090730; JP 2009063616 W 20090730; JP 2010507743 A 20090730; KR 20117003772 A 20090730; US 201113016260 A 20110128