EP 2323808 A1 20110525 - POLISHING PAD WITH FLOATING ELEMENTS AND METHOD OF MAKING AND USING THE SAME
Title (en)
POLISHING PAD WITH FLOATING ELEMENTS AND METHOD OF MAKING AND USING THE SAME
Title (de)
POLIERKISSEN MIT SCHWIMMENDEN ELEMENTEN UND HERSTELLUNGS- UND VERWENDUNGSVERFAHREN DAFÜR
Title (fr)
TAMPON DE POLISSAGE AVEC ELEMENTS FLOTTANTS, ET PROCEDE DE FABRICATION ET D'UTILISATION DE CEUX-CI
Publication
Application
Priority
- US 2009051032 W 20090717
- US 8189108 P 20080718
Abstract (en)
[origin: WO2010009420A1] The disclosure is directed to polishing pads with floating polishing elements bonded to a support layer, for example by thermal bonding, and to methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pad includes a multiplicity of polishing elements, at least some of which may be porous, each polishing element affixed to a major surface of a support layer so as to restrict lateral movement of the polishing elements with respect to one or more of the other polishing elements, but remaining moveable in an axis substantially normal to the support layer. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer opposite the polishing elements, and optionally, a polishing composition distribution layer. In some embodiments using porous polishing elements, the pores are distributed substantially at a polishing surface of the polishing elements.
IPC 8 full level
B24B 37/22 (2012.01); B24B 37/20 (2012.01)
CPC (source: EP KR US)
B24B 37/205 (2013.01 - EP US); B24B 37/22 (2013.01 - EP US); B24B 37/24 (2013.01 - KR); B24B 37/26 (2013.01 - EP KR US); B24D 13/14 (2013.01 - KR); B24D 18/00 (2013.01 - KR)
Citation (search report)
See references of WO 2010009420A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
WO 2010009420 A1 20100121; CN 102159361 A 20110817; CN 102159361 B 20141105; EP 2323808 A1 20110525; EP 2323808 B1 20150930; JP 2011528625 A 20111124; JP 5450622 B2 20140326; KR 20110033277 A 20110330; TW 201006606 A 20100216; TW I415711 B 20131121; US 2011183583 A1 20110728
DOCDB simple family (application)
US 2009051032 W 20090717; CN 200980136821 A 20090717; EP 09790596 A 20090717; JP 2011518940 A 20090717; KR 20117003722 A 20090717; TW 98124300 A 20090717; US 200913054691 A 20090717