EP 2327554 B1 20131120 - Thermal head, manufacturing method therefor, and printer
Title (en)
Thermal head, manufacturing method therefor, and printer
Title (de)
Thermokopf, Herstellungsverfahren dafür und Drucker
Title (fr)
Procédé de fabrication de tête thermique, tête thermique, et imprimante
Publication
Application
Priority
JP 2009272668 A 20091130
Abstract (en)
[origin: EP2327554A1] Provided is a thermal head with enhanced strength and improved thermal efficiency including a cavity portion formed therein at a position corresponding to a heating resistor. Employed is a thermal head (1) including: a support substrate (3) including a concave portion (2) formed in its front surface; an upper substrate (5) bonded in a stacked state to the front surface of the support substrate (3); a heating resistor (7) provided on the front surface of the upper substrate (5) at a position corresponding to the concave portion (2); a pair of electrode portions (8) provided on both sides of the heating resistor (7); and a concave portion (20) formed in the front surface of the upper substrate (5) on a side of the pair of electrode portions (8), the concave portion being provided between the pair of electrode portions (8).
IPC 8 full level
B41J 2/335 (2006.01)
CPC (source: EP US)
B41J 2/33535 (2013.01 - EP US); B41J 2/33585 (2013.01 - EP US); B41J 2/3359 (2013.01 - EP US); Y10T 29/49083 (2015.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2327554 A1 20110601; EP 2327554 B1 20131120; CN 102166887 A 20110831; CN 102166887 B 20150520; JP 2011115950 A 20110616; JP 5477741 B2 20140423; US 2011128340 A1 20110602; US 8379070 B2 20130219
DOCDB simple family (application)
EP 10189286 A 20101028; CN 201010587483 A 20101130; JP 2009272668 A 20091130; US 92730610 A 20101110