Global Patent Index - EP 2327808 A1

EP 2327808 A1 20110601 - MAGNESIUM-BASED COMPOSITE MATERIAL HAVING TI PARTICLES DISPERSED THEREIN, AND METHOD FOR PRODUCTION THEREOF

Title (en)

MAGNESIUM-BASED COMPOSITE MATERIAL HAVING TI PARTICLES DISPERSED THEREIN, AND METHOD FOR PRODUCTION THEREOF

Title (de)

VERBUNDMATERIAL AUF MAGNESIUMBASIS MIT DARIN DISPERGIERTEN TI-PARTIKELN SOWIE VERFAHREN ZU SEINER HERSTELLUNG

Title (fr)

MATERIAU COMPOSITE A BASE DE MAGNESIUM DANS LEQUEL SONT DISPERSEES DES PARTICULES DE TI ET PROCEDE DE PRODUCTION ASSOCIE

Publication

EP 2327808 A1 20110601 (EN)

Application

EP 09811322 A 20090316

Priority

  • JP 2009055026 W 20090316
  • JP 2008226260 A 20080903

Abstract (en)

A Ti particle-dispersed magnesium-based composite material is a material having titanium particles uniformly dispersed in a magnesium matrix. Magnesium that forms the matrix and titanium particles are bonded together,) with satisfactory wettability without titanium oxide at an interface therebetween. The Ti particle-dispersed magnesium-based composite material has a tensile strength of 230 MPa or more.

IPC 8 full level

C22C 23/00 (2006.01); B22F 1/00 (2006.01); B22F 9/04 (2006.01); B22F 9/08 (2006.01); C22C 1/00 (2006.01); C22C 1/02 (2006.01); C22C 1/04 (2006.01); C22F 1/00 (2006.01); C22F 1/02 (2006.01); C22F 1/06 (2006.01)

CPC (source: EP US)

B22F 9/082 (2013.01 - EP US); C22C 1/00 (2013.01 - EP US); C22C 1/02 (2013.01 - EP US); C22C 1/0408 (2013.01 - EP US); C22C 14/00 (2013.01 - EP US); C22C 23/00 (2013.01 - EP US); C22F 1/02 (2013.01 - EP US); C22F 1/06 (2013.01 - EP US); B22F 2009/0804 (2013.01 - EP US); B22F 2998/10 (2013.01 - EP US)

Citation (search report)

See references of WO 2010026793A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

EP 2327808 A1 20110601; CN 102016094 A 20110413; JP 2010059480 A 20100318; JP 4397425 B1 20100113; KR 20100092055 A 20100819; US 2011150694 A1 20110623; WO 2010026793 A1 20100311

DOCDB simple family (application)

EP 09811322 A 20090316; CN 200980114389 A 20090316; JP 2008226260 A 20080903; JP 2009055026 W 20090316; KR 20107015461 A 20090316; US 200913060078 A 20090316