EP 2329698 A1 20110608 - MITIGATION OF WHISKERS IN SN-FILMS
Title (en)
MITIGATION OF WHISKERS IN SN-FILMS
Title (de)
MINDERUNG VON WHISKERS BEI SN-FILMEN
Title (fr)
LIMITATION DE TRICHITES DANS DES FILMS SN
Publication
Application
Priority
US 2008073850 W 20080821
Abstract (en)
[origin: WO2010021624A1] An electronic device includes a metallic conducting lead having a surface. A pre-solder coating over the surface consists essentially of tin and one or more dopants selected from Al or a rare earth element.
IPC 8 full level
H05K 3/24 (2006.01); H01L 23/495 (2006.01)
CPC (source: EP KR US)
C23C 10/02 (2013.01 - EP US); C23C 10/04 (2013.01 - EP US); C23C 26/00 (2013.01 - EP US); H01L 23/495 (2013.01 - KR); H01L 23/49534 (2013.01 - EP US); H01L 23/49582 (2013.01 - EP US); H01L 23/49866 (2013.01 - EP US); H05K 3/24 (2013.01 - KR); H05K 3/244 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H05K 2201/0769 (2013.01 - EP US)
Citation (search report)
See references of WO 2010021624A1
Citation (examination)
- WO 2006134665 A1 20061221 - FUJITSU LTD [JP], et al
- US 2010089982 A1 20100415 - SAKUYAMA SEIKI [JP]
- JP H07266080 A 19951017 - TOYOTA CENTRAL RES & DEV
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
WO 2010021624 A1 20100225; CN 102132638 A 20110720; CN 102132638 B 20140129; EP 2329698 A1 20110608; JP 2012500493 A 20120105; KR 20110044793 A 20110429; TW 201016896 A 20100501; TW I399461 B 20130621; US 2011155418 A1 20110630; US 8653375 B2 20140218
DOCDB simple family (application)
US 2008073850 W 20080821; CN 200880130797 A 20080821; EP 08819964 A 20080821; JP 2011523783 A 20080821; KR 20117006285 A 20080821; TW 98127625 A 20090817; US 200813059502 A 20080821