EP 2330604 A4 20180328 - COMPOSITE ELECTRONIC COMPONENT
Title (en)
COMPOSITE ELECTRONIC COMPONENT
Title (de)
ELEKTRONISCHE VERBUNDKOMPONENTE
Title (fr)
COMPOSANT ÉLECTRONIQUE COMPOSITE
Publication
Application
Priority
- JP 2009067311 W 20090929
- JP 2008253647 A 20080930
Abstract (en)
[origin: EP2330604A1] It is provided a composite electronic part having magnetic material 1 and dielectric material 2 and made by co-sintering at a temperature of 1000 °C or lower. The magnetic material 2 comprises a ferrite comprising 46 to 48 mol% of Fe203, 0.1 to 36 mol% of ZnO, 10 to 14 mol% of CuO and the balance being NiO. The dielectric material 1 has a dielectric constant of 1000 or higher, and comprises a barium titanate based dielectric material to which 0.5 to 4.0 weight parts of CuO and 4.0 to 9.0 weight parts of Bi 2 O 3 are added with respect to 100 weight parts of the barium titanate based dielectric material.
IPC 8 full level
H01G 4/40 (2006.01); B32B 18/00 (2006.01); C04B 35/26 (2006.01); C04B 35/468 (2006.01); C04B 37/00 (2006.01); H01F 1/34 (2006.01); H01F 27/00 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H01G 4/12 (2006.01); H03H 1/00 (2006.01); H03H 7/01 (2006.01); H03H 7/075 (2006.01); H03H 7/42 (2006.01)
CPC (source: EP US)
B32B 18/00 (2013.01 - EP US); C04B 35/265 (2013.01 - EP US); C04B 35/4682 (2013.01 - EP US); C04B 37/005 (2013.01 - EP US); H01F 1/344 (2013.01 - EP US); H01F 41/0246 (2013.01 - EP US); H01F 41/046 (2013.01 - EP US); H01G 4/1227 (2013.01 - EP US); H01G 4/40 (2013.01 - EP US); H03H 1/0007 (2013.01 - EP US); C04B 2235/3215 (2013.01 - EP US); C04B 2235/3232 (2013.01 - EP US); C04B 2235/3279 (2013.01 - EP US); C04B 2235/3281 (2013.01 - EP US); C04B 2235/3284 (2013.01 - EP US); C04B 2235/3298 (2013.01 - EP US); C04B 2235/6025 (2013.01 - EP US); C04B 2235/656 (2013.01 - EP US); C04B 2235/96 (2013.01 - EP US); C04B 2237/10 (2013.01 - EP US); C04B 2237/34 (2013.01 - EP US); C04B 2237/346 (2013.01 - EP US); C04B 2237/708 (2013.01 - EP US); H03H 7/427 (2013.01 - EP US)
Citation (search report)
- [I] WO 2006085625 A1 20060817 - SOSHIN ELECTRIC [JP], et al
- [I] WO 2007122948 A1 20071101 - NGK INSULATORS LTD [JP], et al
- [A] JP 2001010820 A 20010116 - TDK CORP
- [A] JP 2003272912 A 20030926 - MURATA MANUFACTURING CO
- See references of WO 2010038890A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2330604 A1 20110608; EP 2330604 A4 20180328; CN 102165543 A 20110824; JP 5386496 B2 20140115; JP WO2010038890 A1 20120301; US 2011162877 A1 20110707; US 8563871 B2 20131022; WO 2010038890 A1 20100408
DOCDB simple family (application)
EP 09817919 A 20090929; CN 200980138515 A 20090929; JP 2009067311 W 20090929; JP 2010531938 A 20090929; US 201113023650 A 20110209