EP 2333127 A4 20120704 - COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT
Title (en)
COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT
Title (de)
KUPFERLEGIERUNGSMATERIAL FÜR ELEKTRISCHE UND ELEKTRONISCHE BAUTEILE
Title (fr)
MATIÈRE D'ALLIAGE DE CUIVRE POUR UN COMPOSANT ÉLECTRIQUE/ÉLECTRONIQUE
Publication
Application
Priority
- JP 2009063614 W 20090730
- JP 2008202469 A 20080805
Abstract (en)
[origin: EP2333127A1] A copper alloy material for electrical/electronic components, which is characterized by containing 0.7-2.5% by mass of Co, while containing Si in such an amount that the mass ratio between Co and Si (Co/Si) is not less than 3.5 but not more than 4.0, with the balance made up of Cu and unavoidable impurities. The copper alloy material is also characterized by having a crystal grain size of 3-15 [mu]m.
IPC 8 full level
C22C 9/06 (2006.01); C22F 1/08 (2006.01); H01B 1/02 (2006.01)
CPC (source: EP US)
C22C 9/06 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US); H01B 1/026 (2013.01 - EP US)
Citation (search report)
- [XI] JP 2008088512 A 20080417 - NIKKO KINZOKU KK
- [X] WO 2007139213 A1 20071206 - FURUKAWA ELECTRIC CO LTD [JP], et al
- [XI] JP S63307232 A 19881214 - SUMITOMO METAL MINING CO
- [A] JP H0920943 A 19970121 - FURUKAWA ELECTRIC CO LTD
- [A] JP 2007169764 A 20070705 - FURUKAWA ELECTRIC CO LTD
- See references of WO 2010016428A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2333127 A1 20110615; EP 2333127 A4 20120704; CN 102112641 A 20110629; CN 102112641 B 20130327; JP WO2010016428 A1 20120119; KR 20110039372 A 20110415; US 2011200480 A1 20110818; WO 2010016428 A1 20100211
DOCDB simple family (application)
EP 09804912 A 20090730; CN 200980130454 A 20090730; JP 2009063614 W 20090730; JP 2010523839 A 20090730; KR 20117004941 A 20090730; US 201113021444 A 20110204